XC7A7A200T-2FFG1156E
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 215,360
شرائح المنطق: 33,650
ذاكرة الوصول العشوائي المدمجة (eRAM): 13,140 كيلو بايت (365 × 36 كيلو بايت من ذاكرة الوصول العشوائي المجمعة)
الحد الأقصى لإدخال/إخراج المستخدم: 500
الحزمة: FFG1156 (Flip-Chip BGA)
درجة السرعة: -2
درجة حرارة التشغيل: ممتد (من 0 درجة مئوية إلى +100 درجة مئوية)
المواصفات
تعريف رقم القطعة
This is a high-density extended industrial temperature FPGA belonging to Xilinx Artix-7 series, manufactured via mature 28nm low-power semiconductor process. It balances ample computing resources, flexible I/O scalability and favorable cost, designed for complex embedded vision, multi-channel data acquisition and industrial communication devices requiring wide-temperature stable operation and abundant peripheral expansion interfaces.
- XC7A200T: Top high-density model of Artix-7 FPGA family
- -2: Speed Grade 2, universal balanced timing grade. It reserves sufficient timing margin for most medium-to-large scale digital designs, realizing an optimal trade-off between operating frequency, timing closure stability and total power consumption
- FFG1156: 1156-ball flip-chip FCBGA large-size package. Massive pin resources support extensive parallel signal access, multi-peripheral docking and full utilization of on-chip high-speed transceivers
- E: Extended industrial temperature rating, operating junction temperature range: -40°C ~ +100°C
On-Chip Hardware Resource Specifications
1. الموارد العامة للمنطق القابل للبرمجة
- Total Logic Cells: 215,360
- Configurable Slices: 33,650
- Total Flip-Flops: 269,200
- Total LUTs: 134,600
2. Arithmetic & Embedded Memory Resources
- DSP48E1 arithmetic slices: 740 units, applicable to FFT signal calculation, digital filtering, real-time image pixel processing, multi-axis motor control algorithms and medium-scale matrix operation acceleration
- Total Block RAM Capacity: 13,140 Kb, used for high-capacity image frame caching, deep FIFO data buffering, waveform storage and algorithm parameter lookup tables
- Distributed RAM Capacity: 3,888 Kb
3. Clock Management Subsystem
- 8 MMCM clock management tiles
- 8 PLL phase locked loops
Supports multi-clock domain generation, clock phase fine adjustment, delay compensation and high-frequency jitter suppression, meeting strict synchronous timing requirements of complex embedded digital systems
4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة
- 8 GTX high-speed differential transceivers
Maximum line rate up to 6.6 Gbps, compatible with PCIe Gen2, Gigabit Ethernet, Aurora, CPRI and other mainstream serial communication protocols
5. واجهات الإدخال/الإخراج ووحدة المراقبة المدمجة في الرقاقة
- Configurable user I/O pins: 560
I/O bank voltage adjustable from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
Integrated dual-channel 12-bit XADC analog monitor, which continuously monitors die junction temperature, all internal power supply voltages and external analog input signals in real time
مواصفات مصدر الطاقة
Nominal core internal operating voltage: 1.0V
Independent isolated power domains are configured for logic fabric, Block RAM, DSP array and high-speed transceivers separately
Typical overall power consumption: 4.5W ~ 18W; passive heat dissipation satisfies conventional continuous operation requirements under most industrial working conditions, while active cooling is recommended under full-load high-temperature operation
متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)
- Package Type: 1156-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered and stored in anti-static trays to prevent electrostatic damage during automated PCB mass production
القدرة على التكيف مع البيئة والموثوقية
The chip maintains stable long-term operation under drastic temperature fluctuations, mechanical vibration, shock and moderate electromagnetic interference harsh industrial environments. It supports AES bitstream encryption protection and SEU single-event upset error detection, featuring excellent cost performance and field anti-interference capability.
سيناريوهات التطبيق النموذجية
- Multi-channel high-precision motion control hosts, large-scale industrial automation main control units
- Multi-port industrial Ethernet convergence gateways, cross-protocol field bus switching equipment
- Multi-channel high-speed signal acquisition analyzers, comprehensive on-site environmental monitoring systems
- Multi-camera industrial machine vision inspection main control boards, real-time image processing platforms
- Medical imaging auxiliary data processing and control modules
- Wide-temperature industrial high-performance SOM core boards and embedded complex algorithm verification platforms
