| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc6vlx550t-2ffg1759i | Virte-6 LXT | -2,00 | 42,96 | 549,888 خلية منطقية | 23,298,048 23 بت | 840 | 0.95 - 1.05 V | التركيب على السطح | -40 درجة مئوية - +100 درجة مئوية (i) | FCBGA-1759 | 1759-FCBGA |
xc6vlx550t-2ffg1759i
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 549,888
شرائح المنطق: 85,920
ذاكرة الوصول العشوائي المدمجة (eRAM): 28,512 كيلو بايت (1,584 × 18 كيلو بايت من ذاكرة الوصول العشوائي المجمعة)
الحد الأقصى لإدخال/إخراج المستخدم: 600
الحزمة: FFG1759 (Flip-Chip BGA)
درجة السرعة: -2
درجة حرارة التشغيل: صناعي (-40 درجة مئوية إلى +100 درجة مئوية)
المواصفات
تفصيل أرقام القطع
This is a flagship large-capacity industrial-grade FPGA from Xilinx Virtex‑6 LXT family, fabricated on mature 40nm semiconductor process. Designed for ultra-complex digital signal processing, hardware emulation, aerospace & defense systems and high-end communication equipment demanding extreme logic scale, wide-temperature rugged reliability and abundant high-speed serial interfaces.
- XC6VLX550T: Top-tier maximum density device of Virtex‑6 LXT series, LXT stands for logic-optimized variant integrated with GTX high-speed transceivers
- -2: Speed Grade 2, mainstream balanced timing grade. It reserves ample timing margin for ultra-large scale high-frequency logic design, balancing maximum operating frequency, timing closure robustness and overall power consumption
- FFG1759: 1759-ball flip-chip FCBGA large-size package, massive ball pins deliver ultra-rich I/O expansion space and complete layout resources for all on-chip transceivers and multi-group parallel signal banks
- I: Industrial temperature grade, junction temperature operating range: -40 درجة مئوية ~ +100 درجة مئوية
On-Chip Hardware Resource Specifications
1. الموارد العامة للمنطق القابل للبرمجة
- Total Logic Cells: 549,120
- Configurable Slices: 85,920
- Total Flip-Flops: 687,360
- Total LUT Lookup Tables: 343,680
2. Arithmetic & Embedded Memory Resources
- DSP48E1 dedicated arithmetic slices: 760 units, optimized for massive FFT, radar baseband processing, cryptography algorithm computation, large matrix operations and multi-channel digital filtering
- Total Block RAM Capacity: 23,298 Kb (4,860 Kb usable dedicated block RAM)
- Distributed RAM Capacity: 7,992 Kb, applied for deep FIFO buffers, waveform caching and on-chip parameter storage tables
3. نظام إدارة الوقت
- 18 MMCM clock management tiles
- 18 PLL phase-locked loops
Supports multi-clock domain generation, phase fine adjustment, clock delay compensation and high jitter attenuation, meeting stringent synchronous timing requirements of ultra-large complex digital systems
4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة
- 24-channel GTX differential serial transceivers
Maximum line rate up to 6.6 Gbps, fully compliant with PCIe Gen2, Aurora, CPRI, Gigabit Ethernet and JESD204 serial communication standards
Embedded hard PCI Express 2.0 endpoint block supports x1/x2/x4/x8 lane configuration
5. I/O Interfaces & System Monitoring Module
- Configurable user I/O pins: 840
I/O bank voltage adjustable from 1.2V to 3.3V, compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
Integrated dual-channel 12-bit XADC System Monitor module, continuously monitors die junction temperature, all internal power rail voltages and external analog input signals in real time
Power Supply Characteristics
Nominal core operating voltage: 1.0V (operating tolerance: 0.95V ~ 1.05V)
Independent isolated power domains are assigned for logic fabric, Block RAM, DSP array and high-speed transceivers respectively
Typical total power consumption: 22W ~ 52W; high-performance forced-air active cooling or dedicated heatsink assembly is mandatory for stable full-load operation under upper temperature limit
متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)
- Package Type: 1759-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering procedures must be finished within 72 hours after vacuum packaging is unsealed
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered and stored in anti-static trays to prevent electrostatic damage during automated PCB mass production
القدرة على التكيف مع البيئة والموثوقية
The chip can operate stably for long durations under severe temperature swings, mechanical shock, vibration and strong electromagnetic interference harsh environments. It supports bitstream AES encryption protection, multi-bitstream fallback reconfiguration and SEU single-event upset detection, featuring exceptional radiation tolerance and operational stability for aerospace, vehicular and rugged field equipment.
سيناريوهات التطبيق النموذجية
- Aerospace onboard signal processing units, airborne radar echo preprocessing systems
- High-speed hardware emulation platforms, ASIC/FPGA prototype verification workstations
- Military software-defined radio baseband main control boards, secure communication encryption equipment
- High-end medical image reconstruction processing systems, CT/MRI data computing modules
- Large-capacity cryptographic computing servers, network security acceleration hardware
- Wide-temperature rugged VPX embedded computing mainboards and ultra-large algorithm development platforms
