| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc4vlx160-11ff111148i | Virtex-4 LX | 16.896,00 | -11,00 | 152064LE | 5308416 بت | 768 | 1.14 فولت ~ 1.26 فولت | التركيب على السطح | صناعي (-40 درجة مئوية إلى +100 درجة مئوية تحت الصفر) | 1148-BBGA, FCBGA, 1148-BBGA | 1148-FCPCPBBGA (35×35) |
XC4VLX160-11FF1148I: Industrial-Grade High-Performance Logic Leader
إن xc4vlx160-11ff111148i represents the pinnacle of the Virtex®-4 LX family, combining massive logic density with the high-performance -11 speed grade و Industrial temperature resilience. Built on the 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this FPGA is specifically designed for engineers who need to solve complex logic challenges without sacrificing timing margins or thermal stability in harsh environments.
Core Engineering Advantages
Superior Timing Margins (-11 Speed Grade): The -11 speed grade offers significantly faster logic switching and reduced propagation delays compared to the standard -10 series. This is critical for high-frequency designs where timing closure is tight.
Industrial-Grade Reliability: Rated for an operating junction temperature range of -40°C to +100°C. This ensures reliable operation in demanding industrial automation, outdoor telecommunications, and aerospace ground systems.
High Logic-to-Pin Ratio: With 152,064 Logic Cells و 768 User I/Os, the LX160 provides the “horsepower” and connectivity required for high-width parallel data processing and multi-interface bridging.
Optimized Memory & DSP Blocks: الميزات 5,184 Kb of Block RAM و 96 DSP48 slices. The DSP48 slices are hard-coded for high-speed arithmetic, making this device highly capable for real-time signal processing (DSP) and filtering.
Flip-Chip Packaging (FF1148): The Flip-Chip BGA package minimizes parasitic inductance and provides excellent thermal conductivity, allowing the chip to maintain performance even under high toggle rates.
Technical Specification Summary
| Metric | المواصفات |
| الخلايا المنطقية | 152,064 |
| CLB Array | 17,136 |
| Total Block RAM | 5,184 Kb |
| DSP48 Slices | 96 |
| Available User I/O | 768 |
| درجة السرعة | -11 (Fast) |
| Temperature Grade | صناعي (-40 درجة مئوية إلى +100 درجة مئوية) |
| نوع الحزمة | FF1148 (Flip-Chip BGA) |
Why Specify the LX160-11I?
1. Mature and Stable Performance
In a market often pushed toward 7-series or UltraScale, the Virtex-4 LX160 remains a “gold standard” for reliability. Its 90nm process is exceptionally stable, offering a predictable EMI profile and robust resistance to single-event upsets compared to smaller, more volatile nodes.
2. Seamless Timing Closure
The jump to the -11 speed grade is a strategic choice for designs involving high-speed memory interfaces (DDR2) or complex LVDS signaling. It provides the extra nanoseconds of slack often required to stabilize a high-utilization design.
3. Long-Lifecycle Support
Choosing this part is ideal for high-value equipment that requires a 10-15 year service life. It is a drop-in high-performance solution for existing Virtex-4 sockets that need better timing performance than the standard grade.
التطبيقات
High-End Industrial Control: Multi-axis robotics and motion control.
Signal Intelligence: Real-time data encryption and high-bandwidth filtering.
Medical Imaging: Complex image reconstruction and ultrasound signal processing.
Test & Measurement: High-speed logic analyzers and automated test equipment (ATE).
