| MÃ SẢN PHẨM | BỘ PHIM | SỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBS | ĐỘ BỀN THEO TỐC ĐỘ | SỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀO | Tổng số bit RAM | SỐ LƯỢNG I/O | Điện áp – Nguồn cấp | Loại lắp đặt | NHIỆT ĐỘ HOẠT ĐỘNG | GÓI / HỘP | GÓI THIẾT BỊ CỦA NHÀ CUNG CẤP |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z045-2FBG676C | Bộ xử lý hệ thống (SoC) Zynq-7000 | 27,33 | -2,00 | ~350.000 LE | 19200000 | 250 | 1,0 V | SMD/SMT | Dùng trong thương mại (0 °C … 85 °C) | FCBGA-676 | FCBGA-676 |
XC7Z045-2FBG676C
Nhà sản xuất: Xilinx
Tế bào logic: ~53,200
Bộ nhớ RAM tích hợp (eRAM): ~2,2 MB
Số lượng I/O: ~676 lượt ghim
Gói: FBG?676
Nhiệt độ hoạt động: Thương mại (0°C đến +85°C)
Thông số kỹ thuật
Định nghĩa mã sản phẩm
This is Xilinx Zynq-7000 high-performance heterogeneous SoC manufactured on the 28nm process node. It integrates dual-core ARM Cortex-A9 processing subsystem and Kintex-7 grade large-capacity FPGA logic resources, designed for commercial high-speed embedded computing, multi-channel image processing and high-bandwidth data acquisition applications.
- XC7Z045: Flagship high-density model of Zynq-7000 series, equipped with Kintex-class programmable logic resources
- -2: Speed Grade 2, mainstream high-speed timing grade with sufficient timing margin for high-frequency logic design
- FBG676: 676-ball flip-chip FCBGA compact package
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Domain)
- Dual-core ARM Cortex-A9 MPCore, maximum operating frequency up to 1000 MHz
- Each core is configured with 32KB instruction cache and 32KB data cache; 1MB shared L2 cache
- Built-in NEON SIMD floating-point acceleration engine for multimedia decoding, digital signal algorithm acceleration
- Abundant standard peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC interface, CAN bus, UART, SPI, I2C, general-purpose GPIO
- Secure boot function is supported to protect system firmware from tampering
2. Programmable Logic (PL: Kintex-7 FPGA Fabric)
- Total Logic Cells: 354,560
- DSP48E1 arithmetic blocks: 1920 units, applied for large-scale FFT computation, digital filtering, wireless baseband preprocessing, multi-channel image algorithm acceleration and matrix operations
- Total Block RAM: 19.2 Mb
- Multiple MMCM and PLL clock management modules to generate multi-group clocks and suppress clock jitter
- No embedded high-speed serial transceivers inside the chip
3. I/O Resources & On-Chip Monitoring Module
- Available user configurable I/O pins: 360
- I/O banks support adjustable voltage from 1.2V to 3.3V, compatible with LVCMOS, LVDS, HSTL and other mainstream differential signal standards
- Integrated dual-channel 12-bit XADC analog monitor: Real-time acquisition of chip internal temperature, power supply voltages and external analog input signals
Thông số kỹ thuật bộ nguồn
Nominal core logic voltage: 1.0 V
Independent power domains are allocated for PS processing system and PL programmable logic respectively
Typical overall power consumption: 13W ~ 34W, a heat sink is required for continuous full-load operation
Yêu cầu về đóng gói và lắp ráp SMT
- Package: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering must be completed within 168 hours after vacuum packaging is unsealed
- Cấu trúc không chứa chì, tuân thủ hoàn toàn các chỉ thị môi trường RoHS
- Được cung cấp trong các khay chống tĩnh điện dành cho sản xuất hàng loạt PCB tự động
Environmental and Reliability Characteristics
Only suitable for stable indoor commercial and laboratory environments, cannot adapt to outdoor extreme high/low temperature industrial scenarios.
It supports bitstream encryption protection and SEU single-event upset detection, delivering stable long-term operation for indoor industrial automation equipment, commercial vision inspection systems and desktop precision test instruments.
Các tình huống ứng dụng điển hình
- High-precision multi-axis motion controllers, centralized control units for automated production lines
- Multi-camera synchronous industrial machine vision platforms, high-speed image capture and processing terminals
- Multi-channel high-speed data recorders, vibration signal analysis and monitoring instruments
- Indoor medical diagnostic equipment main control boards and medical image preprocessing modules
- Intelligent surveillance multi-channel video decoding and edge analysis nodes
- High-performance embedded core boards and algorithm prototype verification platforms for secondary development
