XCZU28DR-2FFVG1517I
Üretici firma: AMD (Xilinx)
RFSoC ADC Kanalları: 16
RFSoC DAC Kanalları: 16
Paket: FFVG1517
Çalışma Sıcaklığı: Endüstriyel (-40°C ila +100°C)
Teknik Özellikler
Part Number Explanation
This is AMD Xilinx Zynq UltraScale+ RFSoC heterogeneous MPSoC based on 16nm FinFET process, which integrates ARM processor system, programmable FPGA logic and built-in RF analog converters, oriented to medium-scale wireless communication, radar and software radio equipment.
- XCZU28DR: Mid-range model of RFSoC series with integrated multi-channel high-speed ADC and DAC radio frequency converters
- -2: Speed Grade 2, mainstream high-speed timing specification with abundant timing margin for baseband algorithm development
- FFVG1517: 1517-ball flip-chip FCBGA package
- I: Industrial temperature grade, operating junction temperature range: -40°C ~ +100°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Processor Subsystem)
- Quad-core Cortex-A53 application processors, used for running Linux operating system, upper-layer communication protocol stacks and application management tasks
- Dual-core lockstep Cortex-R5F real-time processors, responsible for high-reliability real-time control, safety monitoring and low-latency scheduling
- Mali-400 MP2 embedded GPU for simple graphic display and interface rendering
- Integrated dedicated video codec unit to realize multi-channel video encoding and decoding
- Rich peripheral controllers: Dual Gigabit Ethernet, USB 3.0, SD card interface, CAN, UART, SPI, I2C and other industrial general-purpose buses
- On-chip hardware security module supporting secure boot, AES encryption and data anti-tampering protection
2. Programmable Logic Region (PL: FPGA Fabric)
- Total Logic Cells: 504,000
- DSP48E2 arithmetic units: 2080 pieces, mainly used for FFT transformation, digital filtering, channel equalization, matrix operation and wireless baseband signal processing
- Total capacity of Block RAM + UltraRAM: 36.48 Mbit
- Multiple MMCM and PLL clock management tiles, which can complete clock multiplication, division, phase adjustment and jitter filtering to meet the timing requirements of multi-clock complex digital systems
- Multiple configurable I/O banks, supporting LVCMOS, LVDS and various differential signal electrical standards
3. Built-In RF Analog Module (Core RFSoC Advantage)
Integrated high-speed radio frequency sampling converters inside the chip, which avoids the need for external discrete analog chips and simplifies RF circuit design:
- 8-channel 14-bit ADC, maximum single-channel sampling rate 5 GSPS
- 8-channel 14-bit DAC, maximum single-channel update rate 10 GSPS
- Embedded digital up converter (DUC), digital down converter (DDC) and automatic gain control module, which can complete frequency conversion and gain adjustment of radio frequency signals on chip
4. High-Speed Serial Transceivers
16 GTY high-speed differential transceivers, the maximum transmission rate of each lane reaches 32.75 Gbps. It supports PCIe Gen4, 100G Ethernet, JESD204B/C and other mainstream high-speed serial protocols for large-capacity data transmission inside and outside the chip.
Power Supply Specifications
Multi-independent power domains are adopted for PS, PL, RF analog circuits and high-speed transceivers. The typical voltage of core logic is 0.85 V, and dynamic voltage and frequency adjustment can be carried out according to the operating load to balance performance and power consumption.
Typical overall power consumption ranges from 18 W to 42 W, which needs to be matched with heat sinks or forced air cooling heat dissipation schemes.
Ambalajlama ve Montaj Gereklilikleri
- Package: 1517-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3. All reflow soldering operations must be completed within 168 hours after vacuum packaging is opened
- Lead-free packaging, fully compliant with RoHS environmental directives
- Delivered in anti-static trays, suitable for automated mass production of industrial printed circuit boards
Environmental Reliability Features
Stable long-term operation can be maintained under conditions of severe temperature changes and strong electromagnetic interference.
It supports 256-bit AES bitstream encryption, design anti-tampering, SEU radiation error correction, and dual R5F core lockstep redundant operation, which meets the high reliability requirements of military, aerospace and outdoor communication equipment.
Tipik Uygulama Senaryoları
- 5G/6G small cell base stations, indoor distributed radio access equipment
- Portable software-defined radio (SDR), wireless signal receiving and transmitting test platforms
- Miniature phased array radar, ranging radar front-end and signal processing equipment
- Electronic warfare portable signal reconnaissance, interception and monitoring terminals
- Aerospace airborne short-distance communication and remote sensing signal acquisition devices
- Mid-range vector signal generators, spectrum analyzers and communication test instruments
