| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z035-2FBG676C | Zynq-7000 SoC | 0,00 | -2,00 | 275,000 LE | 17,600,000 | 212 | 0.97 - 1.03 V | Yüzey montajı | 0 °C - 85 °C | FBG/FFG-676 | 676-FCBGA (27×27 mm) |
XC7Z035-2FBG676C
Üretici firma: Xilinx
Mantık Hücreleri: ~28,000
Gömülü RAM (eRAM): ~1.0 Mb
I/O Sayısı: ~676 pin
Paket: FBG? 676
Çalışma Sıcaklığı: Ticari (0°C ila +85°C)
Teknik Özellikler
Parça Numarası Ayrıntılı Açıklama
This is a commercial-grade heterogeneous all-programmable SoC from AMD Xilinx Zynq-7000 family, manufactured on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and Kintex-7 mid-to-large scale FPGA fabric, designed for commercial embedded vision, medium-speed signal processing and industrial control equipment with stable indoor operating environment.
- XC7Z035: Mid-high capacity mainstream model of Zynq-7000 series, equipped with Kintex-class programmable logic resources
- -2: Speed Grade 2, standard balanced performance tier, provides sufficient timing margin for conventional high-frequency logic design, balancing operating frequency and power consumption
- FBG676: 676-ball flip-chip FCBGA compact package, dimension: 27mm × 27mm, ball pitch 1.0mm
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor, maximum operating frequency up to 1000MHz
- Each core: 32KB instruction L1 cache + 32KB data L1 cache; 512KB shared L2 cache
- Built-in NEON SIMD floating-point acceleration unit for multimedia decoding, digital signal algorithm calculation acceleration
- On-chip 256KB OCM RAM and boot ROM; supports DDR2/DDR3 external memory
- Rich standard peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, dual CAN 2.0B, UART, SPI, I2C, general-purpose GPIO
- Secure boot with AES encryption supported to prevent firmware tampering
2. Programmable Logic (PL: Kintex-7 FPGA Fabric)
- Total Logic Cells: 277,760
- DSP48E1 dedicated arithmetic slices: 900 units, applied for medium-scale FFT, digital filtering, multi-channel image preprocessing and matrix computation tasks
- Total Block RAM capacity: 17.0 Mb
- Multiple MMCM & PLL clock management tiles for multi-group clock generation and clock jitter suppression
- 8 pairs of GTX high-speed serial transceivers, maximum line rate up to 6.25Gbps, compatible with PCIe Gen2, CPRI, Aurora serial protocols
3. I/O Resources & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 360
- I/O bank voltage adjustable from 1.2V to 3.3V, compatible with LVCMOS, LVDS, HSTL and mainstream differential signal standards
- Integrated dual-channel 12-bit XADC module: Real-time monitoring of chip internal junction temperature, all internal power supply voltages and external analog input signals
Power Supply Specifications
Nominal core logic operating voltage: 1.0V
Independent isolated power domains are allocated for PS processor domain and PL FPGA logic domain separately
Typical overall power consumption: 10W ~ 28W; small aluminum heat sink is required for continuous full-load stable operation
Packaging & SMT Assembly Requirements
- Package: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be finished within 168 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS3 environmental directives
- Packaged in anti-static trays for automated PCB mass production
Environmental & Reliability Characteristics
Only applicable to constant-temperature indoor commercial, office and laboratory environments, cannot adapt to outdoor industrial scenarios with drastic temperature fluctuations and harsh conditions.
It supports 256-bit AES bitstream encryption protection and SEU single-event upset error detection, delivering long-term stable operation performance for indoor automation equipment, commercial visual inspection terminals and desktop precision measuring instruments.
Tipik Uygulama Senaryoları
- Medium-high precision multi-axis industrial motion controllers, centralized control units for automated production lines
- Multi-camera synchronous embedded industrial machine vision inspection platforms, industrial high-speed image acquisition and preprocessing equipment
- Desktop multi-channel data recorders, vibration signal monitoring and analytical instruments
- Indoor medical diagnostic equipment main control boards and medical image preprocessing modules
- Multi-channel video surveillance real-time decoding and edge analysis nodes
- High-performance embedded SOM core boards and medium-complexity algorithm prototype verification platforms
