| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VLX50-1FFG676C | Virtex-5 LX | 3,60 | -1,00 | 46080 | 1769472 | 440 | 0.95 V – 1.05 V | Yüzey Montajı | 0 °C – +85 °C (C) | 676-FBGA / FCBGA | 676-FCBGA (≈27 × 27 mm) |
XC5VLX50-1FFG676C
Üretici firma: Xilinx Mantık Hücreleri: 51,840 Mantık Dilimleri: 8,160 Gömülü RAM (eRAM): 2,448 Kb (136 × 18Kb Block RAM) Paket: FFG676 (Flip-Chip BGA) Çalışma Sıcaklığı: Ticari (0°C ila +85°C)
Teknik Özellikler
XC5VLX330-1FFG1760I is a high-density FPGA designed for complex and large-scale applications requiring massive logic resources.
Temel Özellikler
- Up to 330K logic cells
- High I/O count
- Industrial-grade performance
- Advanced system integration
Technical Specifications
- Package: FFG1760
- Hız Derecesi: -1
- Temperature: -40°C to +100°C
Cross Reference
- XC5VLX330-1FFG1760C
- XC5VLX220-1FFG1760I
Uygulamalar
- Telekom altyapısı
- Data centers
- Military & industrial systems
Stock Availability
🔥 Rare stock available
⏳ Long lead time expected
Call to Action
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