| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX160-10FFG1148C | Virtex-4 LX | 16.896,00 | -10,00 | 152064LE | 5308416 bit | 768 | 1,14 V ~ 1,26 V | Yüzey Montajı | Ticari (0°C ~ +85°C) | 1148-BBGA, FCBGA | 1148-FCPBGA (35×35) |
XC4VLX160-10FFG1148C: High-Capacity Virtex-4 LX Logic Platform
Bu XC4VLX160-10FFG1148C provides the highest logic density available in the logic-optimized Virtex-4 LX family. Built on a 90nm triple-oxide process, this FPGA delivers 152,064 logic cells, allowing for massive parallelization of custom logic and high-speed data path management.
Utilizing the FFG1148 package—a 35mm x 35mm Flip-Chip BGA—this device is designed for systems that require an expansive user I/O count (768 pins) and significant on-chip memory for buffering complex algorithms.
Core Technical Specifications
Mantık Hücreleri: 152,064
CLB Array: 128 x 104
Total Block RAM: 5,184 Kb (Organized in 18 Kb blocks)
DSP48 Slices: 96
Maximum User I/O: 768
Paket: FFG1148 (1.0mm pitch, Lead-Free/RoHS)
Hız derecesi: -10
Temperature Grade: Commercial (0°C to +85°C Junction)
Engineering Implementation & Design Notes
1. Power Distribution Network (PDN) and Thermal Profile
The LX160 has a significant static and dynamic power signature. Because it uses 90nm technology, leakage current ($I_{CCINT}$) is a non-trivial factor, especially as the junction temperature approaches 85°C.
Decoupling: Given the 768 I/O pins, high-speed switching noise is a concern. We recommend a dense decoupling matrix of low-ESR capacitors situated directly under the BGA to mitigate ground bounce and power sag.
2. Large Scale I/O Management
The FFG1148 package provides a massive 768 user I/Os. When assigning pins in your . constraints:
Banking:rails are correctly segmented for the diverse I/O standards supported (LVDS, HSTL, SSTL, etc.).
Signal Integrity: Use the FFG package’s lower inductance to your advantage for high-speed differential pairs, but maintain strict trace-length matching to meet timing in high-density routing.
3. Software and Bitstream Requirements
This device is not supported by Vivado. You must use Xilinx ISE Design Suite (version 14.7). For teams retrieving archived codebases, verify that your timing constraints account for the -10 speed grade propagation delays to ensure setup/hold margins remain valid on this high-density fabric.
Comparison: Virtex-4 LX160 vs. LX100 (FFG1148)
| Özellik | XC4VLX160-10FFG1148C | XC4VLX100-10FFG1148C |
| Mantık Hücreleri | 152,064 | 110,592 |
| BRAM (Kb) | 5,184 | 4,320 |
| DSP48 Slices | 96 | 96 |
| User I/O | 768 | 768 |
Hardware Engineer’s FAQ
Can this part replace a leaded XC4VLX160-10FF1148C?
Yes. The “G” in FFG1148 signifies a Lead-Free (RoHS) package. It is footprint-compatible and functionally identical. However, you must update your reflow profile for lead-free solder (SAC305) to ensure reliable joint formation.
Is it possible to “upspec” to a -11 speed grade if -10 is unavailable?
Yes. A -11 speed grade part is a drop-in replacement for the -10. It will meet all timing requirements of the -10 design and potentially provide better margin, though we recommend a secondary timing analysis in ISE to confirm.
How do you verify the authenticity of this EOL component?
For mature Xilinx silicon, we focus on verifiable Date Codes and top-side marking consistency. We provide visual inspection reports and can perform internal lab testing (X-ray/Solderability) upon request for high-reliability medical or defense applications.
Need a technical quote or a specific Date Code range?
We specialize in sourcing traceable, high-quality Xilinx components for long-term maintenance projects.
Would you like me to pull the specific power-on sequence requirements or the junction-to-case thermal resistance data for the FFG1148 package?
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