| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX160-10FFG1148C | Virtex-4 LX | 16.896,00 | -10,00 | 152064LE | 5308416 비트 | 768 | 1.14V ~ 1.26V | 표면 실장 | 상업용(0°C ~ +85°C) | 1148-BBGA, FCBGA | 1148-FCPBGA(35×35) |
XC4VLX160-10FFG1148C: High-Capacity Virtex-4 LX Logic Platform
그리고 XC4VLX160-10FFG1148C provides the highest logic density available in the logic-optimized Virtex-4 LX family. Built on a 90nm triple-oxide process, this FPGA delivers 152,064 로직 셀, allowing for massive parallelization of custom logic and high-speed data path management.
Utilizing the FFG1148 패키지—a 35mm x 35mm Flip-Chip BGA—this device is designed for systems that require an expansive user I/O count (768 pins) and significant on-chip memory for buffering complex algorithms.
핵심 기술 사양
-
로직 셀: 152,064
-
CLB 배열: 128 x 104
-
총 블록 RAM: 5,184 Kb (Organized in 18 Kb blocks)
-
DSP48 슬라이스: 96
-
최대 사용자 I/O: 768
-
패키지: FFG1148 (1.0mm pitch, Lead-Free/RoHS)
-
속도 등급: -10
-
온도 등급: Commercial (0°C to +85°C Junction)
Engineering Implementation & Design Notes
1. Power Distribution Network (PDN) and Thermal Profile
The LX160 has a significant static and dynamic power signature. Because it uses 90nm technology, leakage current ($I_{CCINT}$) is a non-trivial factor, especially as the junction temperature approaches 85°C.
Decoupling: Given the 768 I/O pins, high-speed switching noise is a concern. We recommend a dense decoupling matrix of low-ESR capacitors situated directly under the BGA to mitigate ground bounce and power sag.
2. Large Scale I/O Management
The FFG1148 package provides a massive 768 user I/Os. When assigning pins in your . constraints:
-
Banking:rails are correctly segmented for the diverse I/O standards supported (LVDS, HSTL, SSTL, etc.).
-
Signal Integrity: Use the FFG package’s lower inductance to your advantage for high-speed differential pairs, but maintain strict trace-length matching to meet timing in high-density routing.
3. Software and Bitstream Requirements
이 장치는 not supported by Vivado. You must use Xilinx ISE Design Suite (version 14.7). For teams retrieving archived codebases, verify that your timing constraints account for the -10 speed grade propagation delays to ensure setup/hold margins remain valid on this high-density fabric.
Comparison: Virtex-4 LX160 vs. LX100 (FFG1148)
| 기능 | XC4VLX160-10FFG1148C | XC4VLX100-10FFG1148C |
| 논리 셀 | 152,064 | 110,592 |
| BRAM (Kb) | 5,184 | 4,320 |
| DSP48 슬라이스 | 96 | 96 |
| User I/O | 768 | 768 |
하드웨어 엔지니어를 위한 FAQ
Can this part replace a leaded XC4VLX160-10FF1148C?
Yes. The “G” in FFG1148 signifies a Lead-Free (RoHS) package. It is footprint-compatible and functionally identical. However, you must update your reflow profile for lead-free solder (SAC305) to ensure reliable joint formation.
Is it possible to “upspec” to a -11 speed grade if -10 is unavailable?
Yes. A -11 speed grade part is a drop-in replacement for the -10. It will meet all timing requirements of the -10 design and potentially provide better margin, though we recommend a secondary timing analysis in ISE to confirm.
How do you verify the authenticity of this EOL component?
For mature Xilinx silicon, we focus on verifiable Date Codes and top-side marking consistency. We provide visual inspection reports and can perform internal lab testing (X-ray/Solderability) upon request for high-reliability medical or defense applications.
기술 견적이나 특정 날짜 코드 범위가 필요하신가요?
We specialize in sourcing traceable, high-quality Xilinx components for long-term maintenance projects.
Would you like me to pull the specific power-on sequence requirements or the junction-to-case thermal resistance data for the FFG1148 package?
LXB 세미콘에 문의 에서 가용성, 가격 및 기술 지원을 확인하세요.
