MPM3632CGQV-Z

MPM3632CGQV-Z is a fully integrated synchronous step-down DC-DC power module designed by Monolithic Power Systems (MPS). It integrates PWM controller, high/low-side power MOSFETs, power inductor and input/output capacitors inside a single package. Only minimal external input and output capacitors are required to implement a complete power supply circuit, greatly simplifying PCB layout and power supply development.

Suffix Explanation

• MPM3632C: Product family, forced Continuous Conduction Mode (CCM) variant
• GQV: 20-pin QFN package with exposed thermal pad
• -Z: Standard tape-and-reel packaging for automated SMT assembly; -P denotes tray packaging

1. Key Electrical Specifications

Input Characteristics

• Wide input voltage range: 4 V ~ 18 V DC
• Integrated UVLO (Under Voltage Lock Out) prevents abnormal operation under insufficient input voltage

Output Characteristics

• Continuous output current: 3 A
• Adjustable output voltage range: 0.8 V ~ 5.5 V, configured via external feedback resistors
• Fixed switching frequency: 3 MHz, enabling compact external passive components
• Constant On-Time (COT) control architecture with fast load transient response
• Forced CCM operation to maintain low output ripple across all load conditions
• Internal soft-start circuit to suppress inrush current during power-up
• Open-drain Power Good (PG) pin to signal stable output voltage to host MCU
• Peak power conversion efficiency up to 95%

2. Comprehensive Built-in Protection Functions

1. Over Current Protection (OCP): Hiccup mode auto-recovery during output short-circuit without permanent device damage
2. Output Over Voltage Protection (OVP) latch to prevent downstream FPGA/MCU damage from overvoltage
3. Thermal Shutdown (TSD) protection: Device shuts down automatically when junction overtemperature and restarts after cooling
4. Input UVLO protection against unstable startup at low input voltage

3. Package & Mechanical Details

• Package Type: 20-pin QFN with exposed thermal pad
• Dimension: 3.0 mm × 5.0 mm × 1.6 mm ultra-small footprint
• Large exposed pad for efficient heat dissipation under full 3A load
• Moisture Sensitivity Level: MSL 3; must be reflow-soldered within 168 hours after package opening
• Total PCB footprint for the entire power solution is approximately 7 mm × 7.9 mm

4. Environmental & Compliance Standards

• Operating junction temperature range: -40 ℃ ~ +125 ℃
• RoHS lead-free and halogen-free compliant, fully REACH SVHC compliant
• Industrial-grade robustness with strong anti-interference capability for harsh electromagnetic industrial environments

5. Typical Application Fields

• Point-of-Load (POL) power supply for FPGA, ARM, DSP and ASIC core rails
• Multi-channel compact buck power supplies for industrial PLC and servo control boards
• Miniaturized power solutions for medical imaging equipment and portable diagnostic instruments
• Distributed power systems for server add-on cards, communication gateways and network switches
• Space-constrained embedded devices, IoT smart hardware and handheld test & measurement instruments

LXB Semicon supplies original MPS MPM3632CGQV-Z fully integrated 3A 18V-input forced CCM step-down power module