| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADSP-21469KBCZ-3 | ADSP-21469 (SHARC ailesi) | 0,00 | 400,00 | N/A | 500000 | 0 | Veri sayfasına göre çekirdek/IO rayları (veri sayfasında gösterilen tipik cihaz VDD'leri) | Yüzey montajı | 0 °C ila +70 °C | 324 bilyeli CSP / 324-BGA (BC-324-1) | BC-324-1 (324-Ball CSP_BGA) |
ADSP-21469KBCZ-3
Üretici firma: Analog Cihazlar
Mantık Hücreleri: бк
Mantık Dilimleri: бк
Gömülü RAM (eRAM): 5 Mbits Yonga Üstü SRAM
Paket: SABP
Çalışma Sıcaklığı: 40°C ila +85°C
Teknik Özellikler
Parça Numarası Tanımı
ADSP-21469 is a fourth-generation SHARC architecture floating-point digital signal processor developed by Analog Devices, focused on multi-channel professional audio processing and high-precision real-time signal computation.
Breakdown of suffix codes:
- K: Extended industrial temperature grade
- BC: 324-ball CSPBGA chip scale ball grid array package, 19mm × 19mm outline dimension
- Z: Fully lead-free, RoHS compliant construction
- -3: Fixed rated core operating frequency of 400 MHz
The component is supplied in anti-static tray packaging for large-scale automated SMT assembly.
Temel Elektriksel Performans Parametreleri
Processor Core Architecture
Adopts Super Harvard dual SIMD parallel computing structure, equipped with two independent arithmetic processing units. Each unit contains ALU, hardware multiplier and barrel shifter to execute multiply-accumulate operations simultaneously in one instruction cycle.
Supports 32-bit single-precision floating-point, 40-bit extended precision floating-point, plus 8/16/32-bit fixed-point arithmetic calculation. Built-in dedicated hardware accelerators for FFT, FIR and IIR filtering algorithms to greatly shorten the runtime of common signal processing algorithms. It maintains full code compatibility with all previous SHARC series DSP chips.
Çip Üzerindeki Bellek Kaynakları
Total integrated high-speed SRAM reaches 5 Mbits, which can be arbitrarily divided into program memory and data buffer memory according to application requirements. Multi-group independent internal buses eliminate internal data transmission bottlenecks and guarantee stable continuous streaming data processing performance. No on-chip flash memory is integrated; firmware must be loaded from external storage after power-on.
Entegre Çevre Birimi Arayüzleri
- DAI configurable digital audio interface: supports I2S, TDM, SPDIF audio protocols, with built-in 8-channel asynchronous sample rate converters
- 8 SPORT synchronous serial ports for direct connection with audio codec chips
- Two high-speed Link Ports for multi-DSP cascading and high-speed point-to-point data transmission
- Dual SPI buses, 1 UART, I2C bus, 16-channel PWM output channels and three programmable hardware timers
- Embedded 16-bit DDR2 external memory controller for expanding large-capacity off-chip data storage
- Advanced multi-channel DMA controller with scatter-gather and delay-line DMA functions, completing background data transmission without occupying core computing resources
- IEEE 1149.1 standard JTAG debug interface for program downloading, online debugging and system fault diagnosis
Güç Kaynağı Teknik Özellikleri
- Core digital supply voltage: 1.0V ~ 1.1V, typical value 1.05V
- Analog circuit and digital I/O power supply: fixed 3.3V
Ambalajlama ve Montaj Teknik Özellikleri
Encapsulated in 324-pin CSPBGA surface-mount package with 19mm × 19mm body size. Compact outline saves PCB layout space for professional audio equipment, portable precision measuring instruments and embedded control boards.
Moisture Sensitivity Level: MSL3. All reflow soldering work must be finished within 168 hours once vacuum packaging is opened. Anti-static tray packaging is adopted to meet industrial mass production demands.
Çevre ve Uyum Standartları
Continuous stable operating temperature range: -40°C ~ +85°C. It works reliably under drastic temperature changes and complex electromagnetic interference environments such as factory workshops, outdoor monitoring stations and medical equipment rooms.
Manufactured with lead-free semiconductor processes, fully compliant with global RoHS environmental directives, and kept in continuous official production supply.
Tipik Uygulama Alanları
Professional digital mixing consoles, multi-channel audio effect processing systems
Medical ultrasonic diagnostic equipment real-time acoustic imaging signal calculation modules
Acoustic analyzers, vibration noise testing instruments and industrial fault diagnosis devices
Industrial multi-channel signal acquisition and real-time spectrum analysis embedded systems
Vehicle-mounted multi-channel audio processing equipment and public broadcasting digital audio matrix systems
