| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z100-1FFG1156C | Zynq-7000 SoC | 0,00 | -1,00 | 444,000 LE | 27787264 | 400 | 0.97 - 1.03 V | Крепление на поверхность | 0 °C - 85 °C | FFG-1156 / FCBGA-1156 | 1156-FCBGA |
XC7Z100-1FFG1156C
Производитель: Xilinx
Логические ячейки: ~101,000
Встроенная оперативная память (eRAM): ~4,9 Мб
Количество входов/выходов: ~1 156 пинов
Упаковка: FFG-1156
Рабочая температура: Коммерческий (от 0°C до +85°C)
Технические характеристики
Part Number Breakdown
This is the flagship highest-performance heterogeneous all-programmable SoC of Xilinx Zynq-7000 family, built on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and top-tier Kintex-7 ultra-large-scale FPGA programmable logic, designed for high-throughput signal processing, multi-channel ultra-high-definition video computing, software-defined radio and high-speed data gateway applications in stable indoor commercial environments.
- XC7Z100: Top flagship model of Zynq-7000 series, equipped with maximum Kintex-7 FPGA resources across the whole product lineup
- -1: Speed Grade 1, highest-speed timing grade, delivers the maximum operating frequency and optimal timing performance with the smallest propagation delay, dedicated for ultra-high-frequency complex digital logic designs
- FFG1156: 1156-ball flip-chip FCBGA large package, expanded pin count to carry abundant general I/O and high-speed peripheral signals
- C: Commercial temperature grade, operating junction temperature range: 0°C ~ +85°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor, maximum operating frequency up to 1000MHz
- Each core features independent 32KB instruction L1 cache + 32KB data L1 cache; 1MB shared L2 cache
- Integrated NEON SIMD floating-point acceleration engine for large-volume multimedia decoding, digital signal algorithm and embedded system computing acceleration
- On-chip 256KB OCM on-chip memory; supports external DDR2/DDR3 high-speed memory expansion
- Comprehensive built-in peripheral controllers: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO
- Supports AES encrypted secure boot and SHA-256 integrity verification to prevent firmware tampering and ensure system security
2. Programmable Logic (PL: Kintex-7 Top-tier FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, suitable for massive-scale FFT calculation, digital filtering, wireless baseband signal processing, multi-channel 4K/8K image algorithm acceleration and large matrix computation tasks
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM & PLL clock management tiles to generate multi-group reference clocks and suppress high-frequency clock jitter
- 16-channel GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2 x8, 10G Ethernet, CPRI, JESD204B, Aurora mainstream high-speed serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 528
- I/O bank voltage adjustable between 1.2V and 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die internal junction temperature, all internal power supply voltages and external analog input signals
Технические характеристики источника питания
Nominal core logic operating voltage: 1.0V
Independent isolated power domains are allocated separately for PS processor domain and PL FPGA logic domain
Typical overall power consumption: 18W ~ 42W; active heatsink with fan is required for stable continuous full-load operation
Packaging & SMT Assembly Requirements
- Package type: 1156-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is unsealed
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
Environmental Adaptability & Reliability
It is exclusively designed for constant-temperature indoor scenarios such as equipment rooms, laboratories and data centers, and cannot adapt to outdoor industrial environments with severe temperature fluctuations and strong electromagnetic interference.
It supports 256-bit AES bitstream encryption protection and SEU single-event upset error detection, featuring ultra-high computing throughput and long-term stable running performance for high-end commercial signal processing devices, multi-channel video servers and desktop high-precision test measurement instruments.
Типичные сценарии применения
- Software-defined radio (SDR) baseband processing platforms, wireless communication test instruments
- Multi-channel 4K/8K video real-time encoding, decoding, stitching and intelligent analysis servers
- High-end oscilloscopes, spectrum analyzers and ultra-high-speed multi-channel data acquisition recorders
- Data center low-latency network gateways, storage acceleration control modules
- Medical high-precision image reconstruction and diagnostic main control equipment
- High-performance embedded SOM core modules and ultra-complex algorithm prototype verification platforms
