| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K420T-2FFG1156I | Kintex-7 | 32.575,00 | -2,00 | 416,960 | 30781440 | 400 | 0,97 - 1,03 В (обычно 1,0 В) | Крепление на поверхность | -40 °C - 100 °C | 1156-FCBGA | 1156-FCBGA (35×35 мм) |
XC7K420T-2FFG1156I
Производитель: Xilinx
Логические ячейки: 419,840
Логические срезы: 65,600
Встроенная оперативная память (eRAM): 30 240 Кб (840 × 36 Кб блочной оперативной памяти)
Максимальный пользовательский ввод/вывод: 500
Упаковка: FFG1156 (Flip-Chip BGA)
Класс скорости: -2
Рабочая температура: Промышленные (от -40°C до +100°C)
Технические характеристики
Part Number Definition
This industrial temperature grade FPGA belongs to AMD Xilinx Kintex-7 family, fabricated on mature unified 28nm HKMG semiconductor process with standard 7-series architecture. It delivers balanced logic capacity, digital signal processing performance, high-speed serial bandwidth and cost efficiency, designed for outdoor industrial signal processing equipment, ruggedized military communication modules, vehicle-mounted embedded computing platforms, field portable test instruments and airborne auxiliary electronic systems requiring stable continuous operation across the full industrial temperature range.
- XC7K420T: Large-capacity mainstream device of Kintex-7 lineup, renowned for optimal price-performance ratio, widely adopted in medium-to-large digital system development for communication, radar, industrial control and signal processing fields
- -2: Speed Grade 2, medium timing performance specification. It strikes a balance between maximum operating frequency and overall power consumption, suitable for devices that need stable high-speed operation without pursuing extreme clock performance
- FFG1156: 1156-ball flip-chip FCBGA package with physical dimension 35mm × 35mm. Abundant ball pins support full deployment of all integrated GTX transceivers, dual-type general I/O banks and multi-channel large-capacity DDR3 memory interfaces, featuring excellent thermal dissipation and signal integrity
- I: Industrial temperature rating, continuous junction temperature operating range: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total System Logic Cells: 416,960
- Configurable CLB Slices: 65,150
- Total Flip-Flops: 1,303,000
- Total LUT Lookup Tables: 651,500
- Distributed RAM Capacity: 5.94 Mb
2. Arithmetic & Embedded Memory Resources
- DSP48E1 arithmetic slices: 1,680 units, applicable to fixed-point/floating-point calculation, large-scale FFT spectrum analysis, wireless baseband signal demodulation, radar echo data processing and cryptographic algorithm acceleration tasks
- Total Block RAM Capacity: 30.06 Mb, used for image frame buffering, deep-depth FIFO data caching, waveform raw data storage and algorithm parameter table storage
3. Clock Management Subsystem
- 8 MMCM clock management tiles
- 8 PLL phase-locked loops
Multiple mutually independent clock domains can be freely configured. The subsystem supports precise clock phase shifting, signal transmission delay compensation and low-jitter clock generation, fully meeting strict synchronous timing requirements of complex communication and digital signal processing systems
4. High-Speed Serial Transceivers
- 32 GTX differential high-speed serial transceivers
Maximum single-lane transmission rate reaches 12.5 Gbps, compatible with PCIe Gen2, 10G Ethernet, Aurora, JESD204B and mainstream industrial high-speed serial communication protocols. Built-in hard protocol controllers effectively shorten the development cycle of high-bandwidth data transmission interfaces
5. I/O Interfaces & On-Chip Monitoring Module
- Total configurable user I/O pins: 680
Equipped with dual I/O bank types: HR wide-range I/O supporting 1.2V~3.3V voltage and HP high-speed I/O supporting 1.2V~1.8V voltage, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended & differential signal standards
Embedded XADC system monitoring module continuously collects real-time data of chip junction temperature, internal core supply voltages and external analog input signals
Power Supply Characteristics
Core operating voltage for Speed Grade 2 is set to balance performance and power consumption. Programmable logic fabric, block RAM, DSP arrays and serial transceivers are divided into mutually independent power domains, supporting partial module power gating to dynamically adjust overall power consumption
Typical total power consumption range: 16W ~ 43W. Continuous full-load operation at the upper industrial temperature limit requires forced air cooling configuration
Packaging and SMT Assembly Specifications
- Package Form: 1156-pin Flip-Chip BGA
- Moisture Sensitivity Level: MSL4. All reflow soldering operations must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Devices are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly production
Environmental Adaptability and Operational Reliability
The chip maintains long-term stable operation under drastic temperature fluctuations, mechanical shock, vibration and intense electromagnetic interference harsh environments. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection & correction, with basic anti-radiation reinforcement design, perfectly adapted to outdoor field, vehicle-mounted and miniature aerospace deployment scenarios
Типичные сценарии применения
- Ruggedized military wireless communication baseband processing boards and radar intermediate frequency signal acquisition modules
- Vehicle-mounted intelligent driving perception preprocessing units and wide-temperature industrial edge computing gateways
- Portable field spectrum analyzers and outdoor arbitrary waveform signal generators
- UAV airborne data recording and lightweight communication payload processing boards
- Medium-scale communication chip prototype verification and algorithm development platforms for research institutes
- Industrial high-speed multi-channel data acquisition systems and high-resolution machine vision processing equipment
