XC7A35T-2FGG484I
Производитель: AMD (Xilinx)
Логические ячейки: 33,280
Логические срезы: 5,200
Встроенная оперативная память (eRAM): 1 800 Кб (100 блоков ОЗУ по 18 Кб)
Упаковка: FGG484 (FBGA-484)
Рабочая температура: Промышленные (от -40°C до +100°C)
Технические характеристики
Part Number Breakdown
This is an AMD Xilinx Artix-7 family cost-effective FPGA fabricated on 28nm HKMG low-power process, focused on industrial embedded control, lightweight signal processing and low-to-medium speed data transmission.
- XC7A35T: 35K logic cell entry-level mainstream device of Artix-7 series
- -2: Speed Grade 2, superior timing performance with ample setup/hold margin for high-speed digital circuit design
- FGG484: 484-ball FBGA plastic BGA package, physical size 23mm × 23mm
- I: Industrial temperature grade, operating junction temperature: -40℃ ~ +100℃
On-Chip Hardware Resources
Logic & DSP Computing Resources
- Total Logic Cells: 35,200
- Configurable Logic Slices: 5,500
- DSP48E1 dedicated arithmetic blocks: 90 units, used for simple FFT, digital filtering, sensor data calculation and small-scale multiply-accumulate operations
Встроенная память
- Total Block RAM capacity: 1980 Kbit, composed of independent 18K dual-port RAM blocks for data cache, FIFO buffer and intermediate data storage
- Distributed RAM built by internal LUT resources for ultra-low latency small temporary storage
Clock Management Modules
6 Clock Management Tiles (CMT) integrated on chip; each CMT contains one MMCM plus one PLL. Functions include clock multiplication, division, arbitrary phase offset adjustment and jitter attenuation to fulfill multi-clock domain design requirements.
High-Speed Serial Links, I/O & Analog Monitor
- 4-channel GTP serial transceivers, maximum single lane rate: 6.6 Gbps
Supported protocols: PCIe Gen2, Gigabit Ethernet, Aurora, SFP serial communication
- Available user I/O pins: 250
- I/O banks configurable voltage: 1.2V / 1.5V / 1.8V / 2.5V / 3.3V, compatible with LVCMOS, LVDS and various differential signaling standards
- On-chip dual-channel 12-bit XADC module: monitors die temperature, internal power rail voltages and external analog input signals
Power Supply Specifications
- Nominal core logic voltage: 1.0V
- Multiple isolated power domains support dynamic voltage and frequency scaling for power optimization
- Typical total power consumption: 3W ~ 15W, passive heat dissipation is feasible for compact embedded hardware
Packaging & SMT Assembly Requirements
- Package: 484-pin FBGA surface-mount ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering must be completed within 168 hours once vacuum packaging is opened
- Fully lead-free construction, compliant with RoHS environmental directives
- Packaged in anti-static trays for automated industrial PCB mass production
Reliability & Environmental Features
Capable of stable long-term operation under wide temperature fluctuation and strong electromagnetic interference.
It supports 256-bit AES bitstream encryption for design IP protection, SEU radiation error correction and partial dynamic reconfiguration, suitable for vehicle electronics, outdoor industrial equipment and portable measurement terminals demanding high stability.
Типичные сценарии применения
- Industrial automation: PLC main control units, servo drive boards, industrial bus protocol converters
- Miniature machine vision: industrial camera image acquisition, simple image recognition and video preprocessing
- Portable instruments: vibration data loggers, miniature spectrum analyzers, multi-channel sensor acquisition terminals
- Lightweight SDR front-end control logic, short-range wireless signal transceiving auxiliary boards
- Portable medical diagnostic device main control and signal preprocessing modules
- Custom embedded core boards, serial port expansion adapters and low-speed data acquisition cards
