| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX25-10FFG668C | Virtex-4 SX | 2.688,00 | 0,00 | 24192 Логические элементы | 1 327 104 бит | 448 | 1,14 V ~ 1,26 V | Монтаж на поверхность | Коммерческий (0°C ~ +85°C) | 668-BBGA, FCBGA | 668-FCBGA (27×27) |
XC4VLX25-10FFG668C: Virtex-4 LX Logic-Optimized FPGA
Сайт XC4VLX25-10FFG668C is a fundamental component of the Xilinx Virtex-4 LX platform, designed specifically for logic-intensive applications. Built on a 90nm process using triple-oxide technology, the LX series balances high logic density with managed power consumption.
Сайт -10 speed grade и Commercial temperature rating make this part an ideal fit for high-performance networking, medical imaging backplanes, and industrial automation controllers that require stable, high-speed logic without the overhead of the SX (DSP-heavy) or FX (embedded PowerPC) variants.
Essential Technical Specifications
Логические ячейки: 24,192
CLB Array: 48 x 72
Total Block RAM: 1,296 Kb
DSP48 Slices: 48
Maximum User I/O: 448
Упаковка: FFG668 (Flip-Chip BGA, Lead-Free/RoHS)
Класс скорости: -10
Рабочая температура: От 0°C до +85°C (коммерческий)
Design & Integration Insights
When designing with or sourcing the LX25 in the FFG668 package, several architectural nuances should be considered:
SelectIO Technology: This device supports multiple I/O standards (LVDS, HSTL, SSTL). Designers should pay close attention to the banking rules—specifically, ensuring that the $V_{CCO}$ of a given bank is compatible with all I/O standards assigned to that bank to avoid signal integrity issues.
Clock Management: The Virtex-4 LX features highly flexible Digital Clock Managers (DCMs). For the -10 speed grade, ensure your timing constraints in ISE account for the specific jitter and setup/hold requirements documented in the DS302 datasheet.
Thermal Design: The Flip-Chip (FFG) package offers lower thermal resistance than traditional wire-bond BGAs. However, even at a -10 grade, high logic utilization at high frequencies can lead to significant localized heating. We recommend verifying junction temperature ($T_j$) through thermal simulation if your design exceeds 70% logic utilization.
Hardware Engineer FAQ
Is the XC4VLX25-10FFG668C pin-compatible with larger Virtex-4 LX devices?
Yes, the FFG668 package allows for footprint compatibility with the XC4VLX40 and XC4VLX60 in some configurations, permitting a migration path if your logic requirements grow. Always cross-reference the pinout tables to ensure bank-compatible power pins.
How should I handle the lead-free (FFG) soldering profile?
Since this is a Lead-Free (RoHS) FFG668 package, you must follow a SAC305-compatible reflow profile. Avoid using leaded solder pastes if you require full RoHS compliance for your final assembly.
What is the status of the “Silicon Stepping” for this part?
We supply the latest production steppings. For engineers performing FFF (Form, Fit, Function) replacements on older Rev A or B boards, please verify if your existing bitstream requires a “Stepping-specific” update via ISE.
Связаться с LXB Semicon for availability, pricing, and technical support.
