Технические характеристики
R1LV1616RBG-7SI#B0 is a 16Mbit low-power asynchronous static random access memory chip developed by Renesas Electronics, belonging to the R1LV advanced low-power SRAM product line, designed for battery-powered systems and embedded devices requiring data backup without refresh operation.
Part Number Definition
R1LV1616R represents the core 16Mbit LPSRAM series model with dual configurable bit width. BG stands for TFBGA packaging form. 7SI indicates 70ns access speed, industrial temperature grade and standard industrial specification configuration. #B0 refers to the factory production batch and specification revision mark, with tray packaging as the default shipping method for automated SMT assembly.
Core Memory Architecture & Timing Parameters
Total storage capacity reaches 16Mbit, supporting two flexible address-data organization modes: 1M words × 16-bit or 2M words × 8-bit. It adopts fully parallel asynchronous read-write interface, requiring no external clock signal or periodic refresh operation to retain stored data. The maximum random access and write cycle time is 70ns, which meets the response speed requirements of most industrial control and embedded main control systems. All input and output pins comply with TTL electrical level standards, and three-state output design allows multiple memory chips to be directly connected to the same data bus for system expansion.
Power Supply & Low Power Characteristics
The chip operates with a single wide voltage supply ranging from 2.7V to 3.6V, perfectly matching 3.3V mainstream embedded system power rails and lithium battery backup power circuits. It features ultra-low standby quiescent current, which keeps data intact under battery backup mode with extremely minimal power consumption, greatly extending the service life of backup batteries. Multiple power saving modes including chip select disable power down are integrated to cut power consumption when the memory module is not accessed. The internal circuit is fabricated with 0.15μm CMOS process to balance operating speed and power consumption performance.
Interface & Circuit Features
The parallel bus structure includes dedicated address pins, bidirectional data pins and control signal pins for chip selection, output enable and write enable. It supports bit masking function under 16-bit mode to independently modify high byte and low byte data. The output port supports wired OR connection on the bus side, simplifying multi-chip cascading circuit design. No complex peripheral matching circuits are needed during application, only simple pull-up and decoupling capacitors are required to complete the minimum system circuit configuration.
Package & Mechanical Specifications
Package type is 48-pin TFBGA ultra-thin ball grid array package with physical dimension of 7.5mm × 8.5mm × 0.8mm, featuring compact size and low height to adapt to space-limited PCB layout scenarios. Moisture Sensitivity Level is MSL 3, and reflow soldering must be finished within 168 hours after opening the vacuum anti-moisture packaging. The ball pin layout is standardized with good solderability and mechanical shock resistance for mass production assembly.
Environmental & Compliance Standards
Operating temperature range covers -40℃ to +85℃ industrial wide temperature grade, adapting to outdoor equipment, field industrial control equipment and extreme temperature working environments. The product is fully lead-free and complies with RoHS and REACH environmental protection regulations without containing restricted hazardous substances. Optimized EMC design enhances anti-electromagnetic interference capability to ensure stable data storage and reading under complex electromagnetic noise conditions.
Типичные области применения
Industrial PLC main control boards, field data acquisition terminals and intelligent sensor data cache units Handheld measuring instruments, portable medical devices and battery-powered handheld embedded equipment Network communication equipment, router mainboard buffer memory and protocol gateway temporary data storage modules Vehicle-mounted electronic auxiliary control units, automotive instrument panel data backup memory POS payment terminals, access control main controllers and smart home central control module external data memory
LXB Semicon supplies original Renesas R1LV1616RBG-7SI#B0 16Mbit low-power asynchronous SRAM memory IC
