Технические характеристики
AP6256 is an AMPAK dual-band Wi-Fi 5 + Bluetooth 5.4 integrated SiP wireless module built on Broadcom BCM43456 chipset, designed for high-speed wireless transmission, multimedia playback and embedded intelligent terminals that require both 2.4GHz and 5GHz network connectivity and stable long-range Bluetooth communication.
👉 It’s not single-band 2.4GHz low-speed Wi-Fi 4 combo module without 5GHz high-frequency bandwidth.
👉 It’s a compact dual-band high-throughput wireless solution with shared single antenna coexistence design, perfect for 4K media playback, industrial HMI and high-speed IoT embedded equipment.
Key Features of AP6256 Wi-Fi Bluetooth Combo Module
Embedded hardware and terminal manufacturers select AP6256 for dual-band high bandwidth, upgraded Bluetooth performance and simplified PCB layout design:
- Dual-band IEEE 802.11 a/b/g/n/ac Wi-Fi 5 (2.4GHz + 5GHz), 1T1R single stream, peak throughput up to 433.3 Mbps on 5GHz band
- Supports 20/40/80MHz channel bandwidth, SGI short guard interval and 256QAM modulation for faster wireless data transmission
- Built-in LDPC encoding/decoding to extend wireless transmission distance and optimize power efficiency
- Bluetooth V5.4 dual-mode: Classic BR/EDR + ultra-low-power BLE, integrated Class 1.5 RF power amplifier for stable long-distance connection
- Advanced ECI enhanced coexistence algorithm for shared single antenna, simultaneous Wi-Fi and Bluetooth transmit/receive without severe RF interference, no external power splitter needed
- Wi-Fi host communication via SDIO 3.0 interface (4-bit SDR104 mode, max 208MHz clock), backward compatible with SDIO 2.0
- Multiple Bluetooth dedicated interfaces: high-speed UART up to 4Mbps, PCM audio interface for voice and audio streaming transmission
- Ultra-compact 12×12×1.65mm stamp LGA SiP package, compact size for slim and miniaturized product structural design
- Wide main power supply range 3.2V–4.8V, independent VDDIO pin for flexible matching of 1.8V/3.3V main control IO voltage
- Built-in complete RF matching circuit, fewer peripheral external components to shorten hardware R&D cycle
- RF transmit power up to 17dBm, receiving sensitivity as low as -96dBm for stable weak signal reception
- Wide operating temperature range: -30°C ~ +85°C, adaptable to indoor consumer and light industrial working environments
- Full wireless security encryption: WEP, WPA/WPA2-PSK, enterprise-level network security protocols
- Native complete driver support for Android, Linux and mainstream embedded RTOS operating systems
- Passed FCC, CE, SRRC, TELEC and BQB official wireless regulatory certifications
- RoHS3 lead-free compliant tape-and-reel packaging, compatible with automated SMT mass production lines
- Stable long-term mass supply support for multimedia equipment and industrial embedded terminal batch production
Типичные применения
Industrial HMI touch screens, digital signage and commercial advertising all-in-one machines
OTT TV boxes, 4K media players, tablet computers and notebook embedded mainboards
Network IPC cameras, smart set-top boxes and vehicle central control display equipment
Smart home central control panels, high-speed wireless gateway and multi-media voice intercom terminals
Self-service retail kiosks, POS payment terminals and portable industrial testing instruments
Battery-powered handheld IoT data collectors and environmental monitoring wireless modules
Wearable smart devices, wireless audio speakers and Bluetooth multi-room audio equipment
Allwinner/Rockchip embedded development boards and lightweight machine vision edge terminals
Medical portable diagnostic display equipment and educational learning machines
LXB Semicon supplies original AMPAK AP6256 dual-band Wi-Fi Bluetooth combo module
