| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU095-1FFVC2104I | XCVU095 | 0,00 | -1,00 | 1,176,000 LE | 60800000 | 884 | 0.85V 일반 | SMD/SMT | 산업 | 2104 FCBGA | 2104-FCBGA |
사양
부품 번호 정의
This industrial temperature low-power FPGA belongs to Xilinx Virtex UltraScale series, built on 20nm FinFET manufacturing process. It carries moderate programmable logic, arithmetic computing and high-speed interface resources, optimized for power-limited miniature rugged embedded equipment, outdoor industrial signal acquisition devices, unmanned vehicle onboard computing modules and portable field measurement instruments that require stable operation across the full industrial temperature range.
- XCVU095: Entry-middle capacity model of Virtex UltraScale product line, equipped with complete high-speed interconnection architecture and compact resource allocation scheme
- -1: Speed Grade 1, low-power optimized timing version. Power consumption control and thermal stability are prioritized over maximum operating frequency, which is ideal for continuously operated devices with limited heat dissipation space and battery-powered products
- FFVC2104: 2104-ball flip-chip FCBGA package. Abundant ball pins realize complete layout of all on-chip transceivers, large-scale general I/O wiring and docking of multi-channel high-speed memory interfaces while ensuring the overall structural compactness of hardware equipment
- I: Industrial temperature grade, continuous junction temperature working range: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total Logic Cells: 1182000
- Configurable CLB Slices: 67560
- Total Flip-Flops: 1351200
- Total LUT Lookup Tables: 675600
- Distributed RAM Capacity: 9.2 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E2 arithmetic blocks: 900 units, applicable to fixed-point and floating-point calculation, large-scale FFT operation, radar signal modulation and demodulation, encryption algorithm acceleration and small and medium matrix computing tasks
- Total Block RAM Capacity: 35.6 Mb, used for image frame buffering, deep FIFO data caching, waveform data storage and algorithm parameter lookup tables
No UltraRAM is embedded inside this chip
3. Clock Management Subsystem
- 12 MMCM clock management tiles
- 12 PLL phase-locked loops
Multiple independent clock domains can be configured flexibly, supporting precise clock phase adjustment, signal delay compensation and high-frequency clock jitter suppression, meeting strict timing synchronization requirements of complex digital systems
4. 고속 직렬 트랜시버
- 24 GTH differential high-speed transceivers
The maximum transmission rate of each single lane reaches 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Built-in hard Ethernet IP cores simplify the development flow of high-bandwidth network interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 928
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all commonly used single-ended and differential signal standards
The built-in system monitoring module continuously monitors chip junction temperature, internal power supply voltages and external analog input signals in real time
Power Supply Characteristics
The nominal core operating voltage of Speed Grade 1 is set for low-power scenarios, ranging from 0.92V to 0.98V. Logic area, block RAM, DSP arrays and serial transceivers adopt mutually isolated power domains, supporting partial module power-off to reduce overall power consumption flexibly
Typical total power consumption ranges from 11W to 38W. For stable continuous full-load operation under the upper limit of industrial temperature, forced air cooling configuration is required
Packaging and SMT Assembly Specifications
- Package form: 2104-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering work must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly production
Environmental Adaptability and Reliability
The chip can operate stably for a long time under drastic temperature changes, mechanical shock, vibration and strong electromagnetic interference harsh environments. It supports AES bitstream encryption, dynamic partial reconfiguration, SEU single-event upset detection and correction, with enhanced anti-radiation performance, suitable for aerospace miniature payload equipment, military portable testing terminals and outdoor field industrial deployment scenarios
일반적인 애플리케이션 시나리오
- Miniature airborne signal processing modules and UAV lightweight payload computing boards
- Compact rugged VPX embedded auxiliary control mainboards for defense industry
- Portable field spectrum analyzers and outdoor arbitrary waveform signal generators
- Outdoor industrial multi-channel sensor data acquisition and real-time processing systems
- Small-scale chip verification platforms with strict space and power limitations
- Vehicular edge data gateways and wide-temperature intelligent perception preprocessing units
