| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z045-2FFG676C | Zynq-7000 SoC | 0,00 | -2,00 | 350,000 LE | 20117760 | 250 | 0.97 - 1.03 V | 표면 실장 | 0°C - 85°C | FFG-676 / FCBGA-676 | 676-FCBGA |
사양
부품 번호 정의
This heterogeneous all-programmable SoC is developed by Xilinx under the Zynq-7000 product line, manufactured with 28nm semiconductor process. It combines dual-core ARM Cortex-A9 processing system and Kintex-7 high-capacity FPGA logic resources, mainly applied to commercial indoor high-performance embedded computing, multi-channel image processing, high-speed signal acquisition and wired communication control devices.
- XC7Z045: Top-tier high logic density model within Zynq-7000 series, integrated with Kintex-series programmable logic
- -2: Speed Grade 2, standard high-performance timing grade, enough timing allowance for complex high-frequency logic design with balanced clock speed and power consumption
- FFG676: 676-ball flip-chip FCBGA package, physical size 27mm × 27mm
- C: Commercial temperature range, operating junction temperature: 0°C ~ +85°C
Full On-Chip Hardware Architecture
1. Processing System (PS Section)
- Dual-core ARM Cortex-A9 MPCore processor, maximum clock frequency up to 1000 MHz
- Each core owns 32KB instruction cache and 32KB data cache; shared 1MB L2 cache
- Integrated NEON SIMD floating-point arithmetic unit to accelerate multimedia decoding and digital signal algorithms
- Built-in 256KB on-chip memory, supports external DDR2 / DDR3 memory expansion
- Peripheral interfaces: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC card interface, dual CAN 2.0B, UART, SPI, I2C, general-purpose GPIO
- AES encrypted secure boot is supported to avoid firmware tampering
2. Programmable Logic (PL Section, Kintex-7 Architecture)
- Total Logic Cells: 354,560
- DSP48E1 arithmetic blocks: 1920 units, deployed for large-scale FFT, digital filtering, wireless baseband signal processing, multi-channel image calculation and matrix operation tasks
- Total Block RAM: 19.2 Mb
- Multiple MMCM and PLL clock management units for multi-clock generation and clock jitter reduction
- 16 GTX high-speed serial transceivers, maximum baud rate 6.25Gbps, compatible with PCIe Gen2, CPRI, Aurora mainstream serial protocols
3. I/O Interfaces & On-Chip Monitoring Unit
- Usable configurable user I/O pins: 360
- Adjustable I/O bank voltage ranging from 1.2V to 3.3V, supports LVCMOS, LVDS, HSTL and common differential signal specifications
- Dual-channel 12-bit XADC integrated on chip: Real-time detection of die internal temperature, internal power supply voltages and external analog input signals
전력 특성
Nominal core voltage: 1.0V
Separate power domains are assigned to PS processing part and PL FPGA logic part
Typical total power consumption: 12W ~ 32W. A compact heatsink is required for long-term continuous full-load running
Packaging and SMT Specifications
- Package type: 676-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL3; reflow soldering must be completed within 168 hours once vacuum packaging is unsealed
- 무연 구조로, RoHS 환경 규정을 완벽하게 준수합니다.
- Delivered in anti-static trays for automated PCB mass production
환경 적응성 및 신뢰성
It is only designed for stable indoor constant-temperature environments like laboratories and equipment rooms, not applicable to outdoor industrial scenes with severe temperature fluctuation.
Equipped with bitstream AES encryption and SEU error detection functions, it maintains stable long-term operation on indoor automation equipment, commercial visual inspection systems and desktop precision measurement instruments.
주요 적용 분야
- High-precision multi-axis motion controllers, central control units for automated production lines
- Multi-camera synchronous industrial vision platforms, high-speed image capture and preprocessing terminals
- Desktop oscilloscopes, spectrum analyzers and multi-channel high-speed data loggers
- Main control boards for indoor medical diagnostic devices and medical image preprocessing equipment
- Multi-channel video decoding, splicing and intelligent surveillance edge analysis nodes
- High-performance embedded SOM modules and complex algorithm verification platforms
