| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC6VLX240T-1FFG1759I | Virtex-6 LXT | 18.840,00 | -1,00 | 241,152 | 15335424 | 720 | 0.95-1.05 V | 표면 실장 | -40°C ~ 100°C(TJ) | 1759-BBGA, FCBGA | 1759-FCBGA |
사양
부품 번호 정의
This industrial temperature grade FPGA belongs to Xilinx Virtex-6 LXT family, fabricated on mature 40nm low-power CMOS semiconductor process. LXT series integrates abundant general logic cells, GTX high-speed serial transceivers and on-chip storage, balancing logic scalability, high-speed interconnection capability and power efficiency, tailored for rugged military communication modules, airborne auxiliary electronic systems, vehicle-mounted signal processing platforms and outdoor industrial broadband data acquisition equipment requiring stable long-term operation across full industrial temperature range.
- XC6VLX240T: Mid-large capacity logic-focused mainstream device of Virtex-6 lineup. It boasts massive programmable logic resources, matched with sufficient memory and high-speed serial channels, widely applied in complex protocol conversion, multi-channel synchronous data acquisition, embedded control and intermediate frequency signal preprocessing scenarios for aerospace, defense and industrial rugged fields.
- -1: Speed Grade 1, low-power timing specification. Thermal stability and static power consumption control are prioritized over maximum operating clock frequency, ideal for continuously running rugged embedded hardware with limited heat dissipation space and strict temperature fluctuation resistance requirements.
- FFG1759: 1759-ball flip-chip FCBGA package, physical dimension 42.5mm × 42.5mm. Ultra-abundant ball pins fully support all integrated GTX transceivers, multi-standard wide-range I/O banks and multi-channel large-capacity DDR3 memory interfaces; the flip-chip structure delivers excellent thermal dissipation and high signal integrity under vibration and temperature variation conditions.
- I: Industrial temperature grade, continuous junction temperature operating range: -40°C ~ +100°C.
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total System Logic Cells: 241,152
- Configurable CLB Slices: 37,680
- Total Flip-Flops: 753,600
- Total LUT Lookup Tables: 376,800
- Distributed RAM Capacity: 3.89 Mb
2. Arithmetic & Embedded Memory Resources
- DSP48E1 arithmetic slices: 768 units, applicable to digital filtering, medium-scale FFT spectrum calculation, wireless communication baseband signal processing, radar pulse echo preprocessing and lightweight cryptographic algorithm acceleration tasks
- Total Block RAM Capacity: 18.70 Mb, composed of independent 36Kb dual-port RAM blocks, used for waveform data buffering, multi-depth FIFO caching, filter coefficient storage and on-chip frame data storage
3. Clock Management Subsystem
- 12 Clock Management Tiles (CMT), each CMT contains 1 MMCM + 1 PLL
Multiple mutually independent clock domains can be flexibly configured. The system supports ultra-low jitter clock generation, precise clock phase shifting and transmission delay compensation, meeting strict synchronous timing demands of multi-clock heterogeneous rugged digital systems.
4. 고속 직렬 트랜시버
- 24 GTX differential high-speed serial transceivers
Maximum single-lane transmission rate reaches 6.25 Gbps, compatible with PCIe Gen2, Serial RapidIO, Aurora, JESD204 and mainstream board-to-board high-speed interconnection protocols; integrated hard protocol controllers simplify multi-board high-bandwidth data transmission design for VPX rugged chassis systems.
5. I/O Interfaces & On-Chip Monitoring Module
- Total configurable user I/O pins: 720
Supports wide I/O voltage range from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended & differential industrial signal standards
Built-in analog monitoring circuit continuously tracks chip junction temperature, internal core supply voltages and external analog input signals in real time.
Power Supply Characteristics
Core operating voltage range: 0.95V ~ 1.05V. Programmable logic fabric, block RAM, DSP arrays and serial transceivers are divided into mutually independent power domains, supporting partial module power gating to dynamically reduce idle power consumption
Typical total power consumption range: 10W ~ 28W. Stable full-load operation at upper industrial temperature limit requires forced air cooling configuration.
Packaging and SMT Assembly Specifications
- Package Form: 1759-pin Flip-Chip BGA
- Moisture Sensitivity Level: MSL4; all reflow soldering operations must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Devices are stored and transported in anti-static trays to avoid electrostatic damage during rugged PCB assembly production
Environmental Adaptability and Operational Reliability
The chip maintains stable long-term operation under drastic temperature swings, mechanical shock, continuous vibration and intense electromagnetic interference harsh environments. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection & correction with basic anti-radiation reinforcement design, perfectly adapted to aerospace, military portable equipment, vehicle-mounted and outdoor industrial harsh working conditions, which commercial temperature grade chips cannot support.
일반적인 애플리케이션 시나리오
- VPX rugged chassis radar intermediate frequency acquisition boards and military wireless communication baseband processing modules
- Airborne data recording equipment and UAV payload signal preprocessing motherboards
- Vehicle-mounted multi-channel sensor synchronous acquisition systems and wide-temperature industrial edge computing gateways
- Portable field broadband signal analyzers and arbitrary waveform generation devices for defense research institutes
- Medium-scale digital system prototype verification platforms for aerospace electronic development
