XC5VFX100T-1FFG1136I

제조업체: 자일링스 로직 셀: 110,592 로직 슬라이스: 17,280 임베디드 RAM(eRAM): 4,320 Kb (240 × 18Kb Block RAM) 패키지: FFG1136 (Flip-Chip BGA) 작동 온도: 산업용(-40°C ~ +100°C)

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    사양

    모델 P/N시리즈실험실/CLBS 수속도 등급논리 요소/셀 수총 램 비트I/O 수전압 - 공급마운팅 유형작동 온도패키지 / 케이스공급업체 디바이스 패키지
    XC5VFX100T-1FFG1136IVirtex-5 FXT8.000,00-1,0010240084049926400.95 V–1.05 V표면 실장-40 °C–+100 °C (I)1136-BBGA, FCBGA1136-FCPBGA (31×31)

    Xilinx XC5VFX100T-1FFG1136I | Virtex-5 FXT FPGA – High-Performance Embedded Systems

    그리고 XC5VFX100T-1FFG1136I is a premier FPGA within the Xilinx Virtex-5 FXT platform, specifically engineered for high-end embedded systems and high-speed serial connectivity. Featuring the integrated PowerPC® 440 processor block 그리고 RocketIO™ GTX 트랜시버, this Industrial-grade (-I) device delivers an unparalleled combination of processing power and I/O bandwidth.

    에서 LXB 세미콘, we specialize in providing authentic, high-reliability Xilinx solutions for industrial, aerospace, and telecommunications sectors.

    Core Technical Specifications

    The XC5VFX100T is characterized by its high logic density and specialized hardware blocks:

    기능Detailed Specification
    논리 셀102,400
    Embedded Processor1 x PowerPC® 440 Core (Up to 550 MHz)
    Transceivers16 x RocketIO™ GTX (Up to 6.5 Gbps)
    DSP48E 슬라이스448
    Total Block RAM8,280 Kb
    작동 온도-40°C to +100°C (Industrial Grade)
    패키지FFG1136 (Flip-Chip BGA, Lead-Free/RoHS)
    속도 등급-1 (Standard)

    Why the XC5VFX100T-1FFG1136I is Critical for Your Design

    The Virtex-5 FXT series was a revolutionary step in FPGA evolution, and the XC5VFX100T remains a cornerstone for several high-demand applications:

    1. Integrated PowerPC® 440 Subsystem

    The onboard PowerPC core allows for complex OS-level tasks (like Linux or VxWorks) directly on the FPGA, reducing the need for an external MCU/CPU and simplifying PCB layout.

    2. Advanced GTX Transceivers

    With 16 GTX transceivers supporting rates up to 6.5 Gbps, this chip is ideal for handling high-speed protocols such as PCI Express® (Gen 1 or Gen 2), Serial RapidIO, 및 Gigabit Ethernet.

    3. Enhanced DSP Capability

    With 448 DSP48E slices, it excels in intensive math-based workloads including radar signal processing, medical imaging, and video encryption.

    4. Industrial Grade (-I) Reliability

    Specifically screened to operate in extreme thermal conditions (-40°C to +100°C), making it the go-to choice for outdoor infrastructure and harsh factory environments.

    Quality Assurance & Supply Chain (LXB Semicon EEAT Protocol)

    When sourcing the XC5VFX100T-1FFG1136I, the biggest risk is counterfeit or refurbished silicon. LXB 세미콘 eliminates this risk:

    • Verified Provenance: We provide full traceability and guarantee that every unit is original Xilinx/AMD silicon.

    • Professional Inspection: Each chip undergoes a rigorous inspection in our ISO-compliant facility, including marking checks, lead inspection, and ESD-safe handling.

    • Expert Consulting: Our engineers can assist with power sequencing requirements and thermal management strategies specific to the FFG1136 package.

    • Legacy Support: We maintain stock for EOL (End of Life) and mature series to prevent production line halts for our long-term partners.


    Frequently Asked Questions (FAQ)

    Q: Which design software supports XC5VFX100T-1FFG1136I? A: This model is supported by 자일링스 ISE® 디자인 제품군. It is not compatible with Vivado®.

    Q: Can I use this chip in a standard commercial environment? A: Yes. The industrial grade (-I) version is a premium upgrade over the commercial version (-C), offering a wider temperature range and higher reliability.

    Q: Is the FFG1136 package compatible with the FF1136? A: Yes, the “G” denotes RoHS/Lead-Free status. They are footprint-compatible, but the FFG1136 is required for modern lead-free manufacturing processes.


    Request a Quote from LXB Semicon Need current pricing or a technical datasheet for the XC5VFX100T-1FFG1136I? Contact our procurement team today for a rapid response.