| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX25-10SFG363C | Virtex-4 SX | 2.688,00 | 0,00 | 24192 논리 요소 | 1,327,104비트 | 240 | 1.14V ~ 1.26V | 표면 실장 | 상업용(0°C ~ +85°C) | 363-FBGA, FCBGA | 363-FCBGA (17×17) |
XC4VLX25-10SFG363C: 90nm Virtex-4 LX in the Compact SF363 Footprint
그리고 XC4VLX25-10SFG363C is a logic-optimized FPGA tailored for high-volume, space-sensitive applications. While the Virtex-4 family is known for its multi-platform approach, the LX25 in the SFG363 package focuses on delivering 24,192 logic cells with a balanced I/O count, making it a frequent choice for localized control logic, interface bridging, and protocol conversion in medical and communications hardware.
그리고 -10 speed grade provides the baseline performance for the 90nm architecture, offering a cost-effective solution for designs that do not require the aggressive timing margins of the -11 or -12 bins.
Technical Core Specifications
로직 셀: 24,192
CLB Array: 48 x 72 (Max Logic Density for the small-form package)
Total Block RAM: 1,296 Kb
DSP48 Slices: 48
최대 사용자 I/O: 240
패키지: SFG363 (17mm x 17mm, 0.8mm Pitch, RoHS Compliant)
속도 등급: -10
Temperature Grade: Commercial (0°C to +85°C $T_j$)
Design & Integration Notes
1. Footprint Efficiency vs. I/O Access
The SFG363 package is roughly 60% smaller by area than the FFG668 variant. However, this comes at the cost of “bonded-out” I/O. With 240 pins available, ensure your pin-assignment (.ucf) does not exceed the physical constraints of this package. If you are migrating a design from a larger Virtex-4 device, you will likely need to re-evaluate your I/O bank assignments.
2. Configuration & Bitstream
This device supports standard configuration modes including Slave Serial, Master Serial, SelectMAP, and JTAG. Given the 24k logic cell density, bitstream sizes are manageable for standard PROM or Flash configurations. Note that the Virtex-4 requires a 1.2V $V_{CCINT}$ rail; ensure your power delivery network (PDN) is characterized for the specific switching transients of the LX fabric.
3. Legacy Tooling (ISE 14.7)
As a reminder for teams maintaining older platforms, the XC4VLX25 is not supported by Xilinx Vivado. You must use the ISE Design Suite. We recommend using the final 14.7 release to ensure all timing models and silicon-specific errata are correctly addressed during synthesis and place-and-route.
Comparison: XC4VLX25 SFG363 vs. FFG668
| 기능 | XC4VLX25-10SFG363C | XC4VLX25-10FFG668C |
| Physical Dimensions | 17mm x 17mm | 27mm x 27mm |
| Ball Pitch | 0.8mm | 1.0mm |
| Available User I/O | 240 | 448 |
| Logic/BRAM/DSP | Identical | Identical |
Engineering FAQ
Is the SFG363 package lead-free?
Yes, the “G” in the SFG363 suffix indicates a Lead-Free (RoHS compliant) package. If you are repairing older equipment that originally used the leaded “SF363” non-G version, this part is functionally and footprint identical, though you should adjust your reflow profile for lead-free solder.
What is the maximum clock frequency for the -10 speed grade?
While $F_{max}$ depends heavily on your logic levels and routing congestion, the -10 grade typically supports internal global clocking up to 400 MHz. For high-speed I/O interfaces, we recommend checking the DC and Switching Characteristics (DS302) for specific $T_{IOPI}$ timing.
Can I use a -11 speed grade part in place of this -10?
Yes. You can always “upspec” to a faster speed grade (-11 or -12) without changing your bitstream, provided the package and temperature grade match. It is a common strategy for stabilizing legacy systems that have tight timing margins.
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