| 모델 P/N | 제조업체 | 데이터시트 | 시리즈 | LAB/CLB 개수 | 속도 등급 | 논리 소자/셀 수 | 총 RAM 비트 | I/O 개수 | Voltage – Supply | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX160-11FFG1148C | 자일링스 | Virtex-4 LX | 16.896,00 | -11,00 | 152064LE | 5308416 비트 | 768 | 1.14V ~ 1.26V | 표면 실장 | 상업용(0°C ~ +85°C) | 1148-BBGA, FCBGA | 1148-FCPBGA(35×35) |
When writing for an independent electronics distribution site, the goal is to speak the language of the Hardware Design Engineer—focusing on timing margins, thermal reliability, and architecture rather than just marketing buzzwords.
Note that the -11 speed grade and FFG (Lead-free) suffix represent a higher performance tier and modern environmental compliance compared to the standard -10 series.
XC4VLX160-11FFG1148C: High-Performance Logic Integration with Precision Timing
그리고 XC4VLX160-11FFG1148C is the high-performance “workhorse” of the Virtex-4 LX family. Featuring the -11 speed grade, this device is optimized for designs requiring tighter timing closures and higher frequency operation. Built on a 90nm process with Xilinx’s ASMBL (Advanced Silicon Modular Block) architecture, it offers a massive logic-to-feature ratio, making it the go-to choice for high-density logic integration.
Engineering Core Features
Enhanced Throughput (-11 Speed Grade): The -11 rating provides a significant performance boost over standard grades, allowing for higher internal clock frequencies and improved setup/hold margins in high-speed data paths.
Massive Logic Density: With 152,064 Logic Cells, this FPGA accommodates complex IP cores, extensive custom RTL, and multi-protocol controllers within a single chip.
Optimized Memory Hierarchy: Includes 5,184 Kb of Block RAM (BRAM). The modular structure allows for deep FIFO implementation and high-speed local caching, minimizing bottlenecks in data-heavy applications.
Advanced Clock Management: Utilizing Digital Clock Managers (DCM) and matched clock trees, the LX160 ensures sub-nanosecond skew control across the entire 1148-pin array.
Eco-Friendly Packaging (FFG1148): 그리고 FFG designation confirms a lead-free (RoHS compliant) Flip-Chip BGA package, designed for superior thermal dissipation and low-inductance power delivery.
Technical Specification Matrix
| 기능 | 사양 |
| 논리 셀 | 152,064 |
| CLB Array | 17,136 |
| Total Block RAM | 5,184 Kb |
| DSP48 Slices | 96 |
| Maximum User I/O | 768 |
| 속도 등급 | -11 (High Performance) |
| 패키지 | FFG1148 (Lead-Free Flip-Chip BGA) |
| 온도 등급 | 상업용(0°C ~ +85°C) |
Hardware Engineer’s Perspective: Application Insights
Reliability Meets Scalability
The XC4VLX160-11FFG1148C is frequently utilized in communications infrastructure 그리고 advanced medical imaging. From a design standpoint, the 768 I/O pins provide immense flexibility for interfacing with high-width parallel buses (such as DDR2 or QDR SRAM) without the routing congestion typical of smaller packages.
Why Specify this Part?
Proven Stability: While newer 7-series FPGAs exist, the Virtex-4 LX160 remains a stable, mature platform for systems that require long-term availability and a proven track record of radiation and EMI tolerance.
Timing Headroom: The -11 speed grade is essential for engineers working on the edge of their timing budget, providing that extra margin needed to stabilize 200MHz+ internal logic fabrics.
Thermal Management: The Flip-Chip (FFG) packaging allows for direct-top cooling solutions, critical when the logic utilization exceeds 80%.
Typical Deployment
Broadcasting: Real-time 4K/HD video processing and encoding.
Computing: High-performance computing (HPC) acceleration and FPGA-based prototyping.
Defense: Signal intelligence and radar processing where high logic-density is non-negotiable.
