| Mfr 부품 | 시리즈 | 제조업체 | 패키지 | 토폴로지 | 제품 상태 | 마운팅 유형 | 스위칭 주파수 | 기능 | 입력 전압 | 출력 전압 | 출력 개수 | 작동 온도 | 출력 유형 | 출력 전류 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LTM4644IY | µModule | 아날로그 디바이스 | BGA | Buck | 활성 | 표면 실장 | 600kHz | DC-DC 레귤레이터 | 4.5 - 20 V | 0.6 - 5.5 V | 1 | -40°C ~ +125°C | 조정 가능 | 4 A |
사양
This is a four-channel integrated step-down μModule power regulator developed by Analog Devices, belonging to the miniature encapsulated complete DC-DC power module series. It fully integrates switching power controllers, power MOSFETs, power inductors, loop compensation circuits and all passive auxiliary components inside the package, which can realize multi-channel independent power output only with a small number of external input and output capacitors.
부품 번호 정의
LTM4644 represents the core model of four-way independent output multi-channel step-down power module. I stands for industrial wide-temperature working specification. Y refers to 77-ball BGA surface mount packaging form. This version adopts traditional solder ball plating process, suitable for industrial equipment stable assembly applications.
주요 전기적 성능 매개변수
The module has four completely independent step-down regulation channels, each channel can continuously output 4A DC current, peak instantaneous current reaches 5A; all four channels can be connected in parallel for current sharing, combined maximum output current up to 16A to meet high-power single rail power supply demands.
Standard input voltage range is 4V~14V; equipped with external auxiliary bias pin, the minimum input voltage can be extended down to 2.375V to adapt to low-voltage front-end power bus. The output voltage of each channel is flexibly adjusted through a single external resistor, adjustable range 0.6V~5.5V, overall output voltage regulation accuracy is controlled within ±1.5%.
Adopts valley current mode control architecture, fast load transient response speed, supports external clock frequency synchronization between multiple modules to eliminate switching frequency interference; built-in programmable soft-start circuit, effectively restrain the surge current generated during power-on startup. It reserves voltage tracking function between multiple power rails, which can realize sequential power supply required by FPGA, chip core and peripheral interfaces.
The overall conversion efficiency can be up to 92% under medium and heavy load conditions, with optimized light-load power consumption design. The interior is embedded with temperature sensing diode leading-out pin, which can monitor the internal real-time temperature of the module in real time. Comprehensive protection mechanisms including overvoltage, overcurrent and overheating shutdown are integrated inside to avoid damage caused by abnormal power supply faults. The fixed switching frequency can be set between 250kHz and 780kHz according to system anti-interference requirements.
포장 및 조립 사양
77-pin plastic BGA encapsulated structure, overall dimension 15mm × 9mm × 5.01mm, compact three-dimensional volume greatly saves PCB board layout space. The internal embedded power inductors and large-area metal substrate have excellent heat conduction performance, and can work stably under continuous full-load operation without additional radiator configuration in most application scenarios.
Classified as MSL3 moisture sensitive electronic component, all reflow soldering operations need to be completed within 168 hours after opening the original vacuum packaging. The product is delivered in standard tray packaging, matching automatic SMT mounting production lines for mass assembly.
환경 및 규정 준수 기준
Industrial grade continuous operating temperature range covers -40℃ ~ +125℃, adapting to communication server mainboards, industrial control computing equipment, outdoor embedded terminals and vehicle-mounted electronic systems with severe ambient temperature changes. The whole device is manufactured with lead-free compliant technology, complying with global environmental material restriction specifications. Highly integrated modular design cancels the complicated peripheral power device layout, shortens hardware development cycle and reduces overall system BOM cost.
일반적인 애플리케이션 분야
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