| Mfr 부품 | 시리즈 | 제조업체 | 패키지 | 토폴로지 | 제품 상태 | 마운팅 유형 | 스위칭 주파수 | 기능 | 입력 전압 | 출력 전압 | 출력 개수 | 작동 온도 | 출력 유형 | 출력 전류 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ADM2587EBRWZ | ADM2587E | 아날로그 디바이스 | 20-SOIC | — | 활성 | 표면 실장 | — | 절연 RS-485 트랜시버 | 3.3 V | RS-485 | 1 | -40°C ~ +85°C | 차별화 | — |
사양
부품 번호 정의
ADM2587E is an isolated full/half-duplex RS485 transceiver with integrated isolated power supply. BRWZ refers to 20-lead wide SOIC surface mount package without tape-and-reel packaging configuration, delivered in trays for prototype development and small batch assembly.
Core Electrical Performance Parameters
Utilizing ADI proprietary iCoupler magnetic isolation technology and built-in isoPower isolated DC-DC converter, this single-chip device integrates digital isolators, RS485 bus transceiver and isolated power generation circuit entirely. No external isolated power module is required to establish galvanically isolated bus communication between control side and field bus side.
It features 2500 Vrms reinforced isolation voltage and 25 kV/μs common-mode transient immunity, which effectively suppresses communication distortion caused by ground loop potential difference in complicated industrial electromagnetic surroundings. The logic side supply voltage ranges from 3.0 V to 5.5 V, compatible with mainstream 3.3 V and 5 V MCU platforms. Internal isolation circuit generates stable 5 V power rail for bus-side circuitry.
The maximum baud rate reaches 500 kbps. Pin configurable full-duplex or half-duplex operation modes are available, supporting up to 256 transceiver nodes on a single bus cable. Comprehensive protection functions are embedded: ±15 kV HBM ESD protection, surge protection, bus short-circuit current limiting and thermal shutdown protection. A fail-safe receiver design keeps output logic high when the bus is open-circuited, short-circuited or idle, preventing invalid random data output. Low static power consumption enables round-the-clock continuous operation for field automation equipment.
Packaging and Assembly Specifications
Packaged in 20-pin wide SOIC surface mount housing. The widened package size satisfies strict safety creepage and clearance requirements for electrical isolation while maintaining compact overall dimensions to save PCB layout space. Moisture Sensitivity Level is MSL3; all reflow soldering operations must be completed within 168 hours after the original vacuum package is opened. Standard tray packaging is adopted to adapt to manual debugging and small-volume production assembly demands.
환경 및 규정 준수 기준
Industrial operating temperature range covers -40 °C to +85 °C, ensuring reliable operation inside frequency converter workshops, power substations, outdoor monitoring terminals and other locations with drastic temperature changes and intensive electromagnetic noise. Produced with lead-free manufacturing techniques, the component complies with RoHS environmental regulations and UL1577 insulation safety certification. High integration greatly reduces external peripheral components, simplifies hardware circuit layout and shortens equipment research and development cycle.
일반적인 애플리케이션 분야
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