Wolfspeed & Rohm Cut SiC Wafer Allocation For Mid-range Automotive Chips, Global Vehicle-grade SiC MOSFET Lead Time Extended to 36–52 Weeks Along With New Round Price Increase

Wolfspeed and Rohm, two leading global SiC chip manufacturers, have adjusted internal wafer allocation schemes in Q3 2026. They concentrate most 6-inch and 8-inch SiC substrate production capacity on high-voltage premium automotive SiC chips, drastically reducing the monthly output quota of mainstream mid-range SiC MOSFET and SiC diode chips used for on-board power conversion.

Accompanied by capacity compression, both manufacturers launched the second price increase within half a year, with quotation rising 12%~24% for all automotive SiC discrete chips and power modules. Authorized global distributors can only receive limited fixed monthly allocations, and new order lead times for conventional automotive SiC chips have been prolonged to 36–52 weeks.

Circulating spot stocks in the market are mixed with refurbished disassembled chips and recoded counterfeit devices, which cannot meet AEC-Q100 vehicle-grade reliability standards.

LXBCHIP pre-stocked large quantities of genuine original sealed SiC chips from Infineon, Wolfspeed, Rohm and onsemi. All chips have traceable batch codes and complete official certification. We support sample urgent delivery, batch separate shipment and full BOM matching service for power semiconductors, helping customers evade long factory waiting cycles and successive price hikes.

Kesimpulan

Shortage of automotive SiC chips will persist until the first half of 2027. Purchasers should lock spot inventory in advance to ensure continuous material supply. Contact our sales team to check real-time stock and apply for bulk preferential prices.