| MODEL P / N | SERI | JUMLAH LABORATORIUM/CLBS | TINGKAT KECEPATAN | JUMLAH ELEMEN / SEL LOGIKA | TOTAL BIT RAM | JUMLAH I / O | TEGANGAN - PASOKAN | JENIS PEMASANGAN | SUHU PENGOPERASIAN | PAKET / KASUS | PAKET PERANGKAT PEMASOK |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z035-L2FBG676E | Zynq-7000 SoC | 0,00 | 0,00 | 275.000 LE | 17,600,000 | 212 | 0.97 - 1.03 V | Pemasangan di permukaan | 0 ° C - 100 ° C | FBG/FFG-676 | 676-FCBGA (27×27 mm) |
XC7Z035-L2FBG676E
Produsen: Xilinx
Sel Logika: ~28,000 (Low Power Version)
RAM tertanam (eRAM): ~1.0 Mb
Hitungan I/O: ~676 pins
Paket: FBG?676
Suhu Pengoperasian: Komersial (0°C hingga +85°C)
Spesifikasi
Part Number Breakdown
This Xilinx Zynq-7000 all-programmable heterogeneous SoC is manufactured on a 28nm process node. It combines dual-core ARM Cortex-A9 processing system and large-scale Artix-7 FPGA logic, designed for low-power wide-temperature rugged industrial, automotive and portable field electronic devices.
- XC7Z035: High-end mid-capacity model of Zynq-7000 series
- L2: Low-power optimized speed grade 2. It works at reduced core voltage to cut static and dynamic power consumption while maintaining stable timing performance, prioritizing power efficiency over peak clock frequency
- FBG676: 676-ball flip-chip FCBGA compact package
- E: Extended industrial temperature grade, junction temperature range: -40°C ~ +125°C
Full On-Chip Hardware Architecture
1. Processing System (PS)
- Dual-core ARM Cortex-A9 MPCore, maximum operating frequency up to 800MHz under low-power configuration
- Each core has 32KB instruction cache and 32KB data cache; 512KB shared L2 cache
- Integrated NEON SIMD floating-point unit for signal calculation and multimedia processing acceleration
- Built-in peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC, CAN bus, UART, SPI, I2C, general GPIO
- Secure boot mechanism is supported to protect system firmware from tampering
2. Programmable Logic (PL, Artix-7 Architecture)
- Total Logic Cells: 277760
- DSP48E1 arithmetic units: 900 units, suitable for medium-scale FFT, digital filtering, multi-channel image preprocessing and matrix operations
- Total Block RAM: 17.0Mb
- Multiple MMCM and PLL modules to generate various clock signals and suppress clock jitter
- No embedded high-speed serial transceivers
3. I/O Resources and On-Chip Monitoring Module
- Available configurable user I/O pins: 360
- I/O bank voltage adjustable between 1.2V and 3.3V, compatible with LVCMOS, LVDS and mainstream differential signal standards
- Dual-channel 12-bit XADC integrated on chip, used for real-time monitoring of chip internal temperature, power supply voltages and external analog input signals
Power Specifications
Standard core voltage: 1.0V
Low-power operating core voltage is lowered to reduce overall power consumption under light and medium loads
Independent power domains are assigned separately for PS and PL parts
Typical total power consumption: 8W ~ 26W. Passive heat dissipation can meet the long-term stable operation requirement of compact battery-powered embedded equipment
Packaging and SMT Requirements
- Package: 676-ball FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL3. Reflow soldering must be finished within 168 hours after vacuum packaging is opened
- Lead-free design, fully compliant with RoHS environmental standards
- Packaged in anti-static trays for automated PCB mass production
Environmental Reliability
The chip can operate continuously and stably under severe temperature variation and strong electromagnetic interference industrial environments.
It supports AES bitstream encryption protection and SEU single-event upset error detection, perfectly matching the application demands of outdoor industrial equipment, automotive electronic control units, handheld measuring instruments and lightweight airborne embedded systems requiring wide temperature adaptability and low power consumption.
Skenario Aplikasi Umum
- Outdoor rugged small industrial controllers and field environmental monitoring edge gateways
- Vehicle-mounted multi-channel data recorders and automotive auxiliary video processing modules
- Handheld portable signal analyzers and field vibration acquisition instruments
- Portable field industrial visual inspection devices
- Miniature short-range radar signal preprocessing peripheral boards
- Wide-temperature industrial low-power SOM core modules and battery-powered embedded algorithm verification platforms
