| MODEL P / N | SERI | JUMLAH LABORATORIUM/CLBS | TINGKAT KECEPATAN | JUMLAH ELEMEN / SEL LOGIKA | TOTAL BIT RAM | JUMLAH I / O | TEGANGAN - PASOKAN | JENIS PEMASANGAN | SUHU PENGOPERASIAN | PAKET / KASUS | PAKET PERANGKAT PEMASOK |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VLX330-2FFG1760I | Virtex-5 LX330 | 25.920,00 | -2,00 | 331776 | 10616832 | 1.200 | 0.95 V – 1.05 V | Pemasangan di Permukaan | -40 °C ~ 100 °C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5 × 42.5 mm) |
XC5VLX330-2FFG1760I
Produsen: Xilinx
Sel Logika: 331,776
Irisan Logika: 51,840
RAM tertanam (eRAM): 11,664 Kb (648 × 18Kb Block RAM)
Maximum User I/O: 768
Paket: FFG1760 (Flip-Chip BGA)
Tingkat Kecepatan: -2
Suhu Pengoperasian: Industri (-40°C hingga +100°C)
Spesifikasi
High-density industrial FPGA designed for complex and high-performance applications.
Fitur Utama
- Up to 330K logic cells
- Industrial temperature (-40°C to +100°C)
- High I/O capacity
Technical Specifications
- Package: FFG1760
- Speed Grade: -2
- Core Voltage: 1.0V
Cross Reference
- XC5VLX330-1FFG1760I
- XC5VLX330-2FFG1760C
- XC5VLX220-2FFG1760I
Aplikasi
- Infrastruktur telekomunikasi
- Data centers
- Otomasi industri
Stock Availability
🔥 Very limited stock
⏳ Long lead time expected
CTA
👉 Request quote now for priority allocation
