XC4VLX100-11FFG1148C

Produsen: Xilinx
Sel Logika: 110,592
Irisan Logika: 49,152
RAM tertanam (eRAM): 4.320 Kb (240 × 18Kb Blok RAM)
Paket: FFG1148 (Flip?Chip BGA)
Suhu Pengoperasian: Komersial (0°C hingga +85°C)

KIRIMKAN PESAN KEPADA KAMI

    Spesifikasi

    MODEL P / NSERIJUMLAH LABORATORIUM/CLBSTINGKAT KECEPATANJUMLAH ELEMEN / SEL LOGIKATOTAL BIT RAMJUMLAH I / OTEGANGAN - PASOKANJENIS PEMASANGANSUHU PENGOPERASIANPAKET / KASUSPAKET PERANGKAT PEMASOK
    XC4VLX100-11FFG1148CVirtex-4 LX12.288,00-11,0011059244236807681.14 V–1.26 VPemasangan di Permukaan0 °C–+85 °C (C)1148-BBGA, FCBGA1148-FCPBGA (35×35)

    XC4VLX100-11FFG1148C: High-Speed Logic Mastery for Commercial System Integration

    The XC4VLX100-11FFG1148C is the high-performance benchmark of the Virtex®-4 LX family, specifically binned for the -11 speed grade. Utilizing Xilinx’s advanced 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device provides a massive 110,592 Logic Cell fabric. It is engineered for designers who require the maximum frequency headroom for logic-heavy designs in commercial-grade applications (0°C to +85°C).

    Housed in the FFG1148 Lead-Free Flip-Chip BGA package, it offers an exceptional I/O-to-logic ratio, making it the premier choice for high-bandwidth data bridging, real-time signal processing, and complex system-on-chip (SoC) integration.

    Core Engineering Highlights

    • Fastest Logic Fabric (-11 Speed Grade): The premium -11 speed grade provides significantly reduced propagation delays, offering the extra timing slack necessary to achieve closure on 300MHz+ internal clock domains.

    • Massive Logic Consolidation: With over 110k Logic Cells and 12,480 CLBs, the LX100 eliminates the need for multi-FPGA partitioning in most mid-to-high range designs, reducing inter-chip latency and PCB complexity.

    • Advanced SelectIO™ Capability: The FFG1148 package breaks out 768 User I/Os. Leveraging Flip-Chip technology, this package ensures low-inductance paths, providing superior signal integrity for high-speed differential pairs (LVDS/HSTL/SSTL) and wide parallel memory buses (DDR2/QDR-II).

    • XtremeDSP™ Hardware Acceleration: Integrated with 96 dedicated DSP48 slices. These hard-coded arithmetic blocks allow for high-speed 18×18 multiplications and MAC operations without consuming general-purpose logic resources.

    • Rich Memory Hierarchy: Fitur 4,320 Kb of Block RAM (BRAM), enabling efficient on-chip data buffering, localized caching, and high-speed FIFO implementations required in real-time streaming applications.


    Technical Specification Matrix

    FiturSpesifikasi
    Sel Logika110,592
    Configurable Logic Blocks (CLBs)12,480
    Total Block RAM4,320 Kb
    DSP48 Slices96
    Maximum User I/O768
    Tingkat Kecepatan-11 (High Performance)
    Suhu PengoperasianKomersial (0°C hingga +85°C)
    Jenis PaketFFG1148 (Lead-Free Flip-Chip BGA)

    Why Specify the LX100-11C?

    1. Reliable Timing in Saturated Designs

    When logic utilization exceeds 75%, routing congestion often kills timing on standard speed grade parts. The -11 speed grade mitigates this “congestion penalty,” ensuring your critical paths meet their frequency targets even when the chip is near capacity.

    2. Superior Power Integrity

    The FFG1148 package is designed with a dense grid of power and ground pins to suppress Simultaneous Switching Noise (SSN). This is a critical factor for engineers driving nearly 800 I/Os at high toggle rates, ensuring clean signal eyes and robust noise margins.

    3. Proven Toolchain & Longevity

    The Virtex-4 LX100 is a mature, field-proven architecture. For commercial products with long lifecycles—such as high-end medical imaging or professional broadcasting gear—the stability of the 90nm process and its well-documented errata offer a low-risk, high-reliability path to production.


    Aplikasi

    • Professional Video: 4K format conversion, real-time encoding/decoding, and high-end switching.

    • Medical Systems: High-speed data acquisition for CT/MRI reconstruction backends.

    • Test & Measurement: Logic analyzer front-ends and high-speed automated test equipment (ATE).

    • Telecommunications: High-speed protocol bridging and localized switching fabrics.