XC4VLX100-10FF1148C

Produsen: Xilinx
Sel Logika: 110,592
Irisan Logika: 49,152 (approx)
RAM tertanam (eRAM): 4.320 Kb (240 × 18Kb Blok RAM)
Paket: FF1148 (Fine-Pitch BGA)
Suhu Pengoperasian: Komersial (0°C hingga +85°C)

KIRIMKAN PESAN KEPADA KAMI

    Spesifikasi

    MODEL P / NSERIJUMLAH LABORATORIUM/CLBSTINGKAT KECEPATANJUMLAH ELEMEN / SEL LOGIKATOTAL BIT RAMJUMLAH I / OTEGANGAN - PASOKANJENIS PEMASANGANSUHU PENGOPERASIANPAKET / KASUSPAKET PERANGKAT PEMASOK
    XC4VLX100-10FF1148CVirtex-4 LX11.520,00-10,009984044789767681,14 V ~ 1,26 VPemasangan di Permukaan0 °C ~ +85 °C (Commercial)1148-BBGA (FCBGA)1148-FCBGA

    XC4VLX100-10FF1148C: High-Density Logic Consolidation for Commercial Computing Platforms

    The XC4VLX100-10FF1148C is a high-capacity FPGA within Xilinx’s legendary Virtex®-4 LX family, specifically engineered for logic-intensive commercial applications. Utilizing the revolutionary 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device provides a massive 110,592 Logic Cell fabric. It is the definitive choice for architects who need to consolidate complex system-level functions—such as multiple soft-core processors, high-bandwidth memory controllers, and extensive custom RTL—into a single, high-reliability silicon footprint.

    Operating at a Commercial-grade (0°C to +85°C) temperature range with a -10 speed grade, it offers a balanced solution for high-end digital signal processing and massive parallel data routing.

    Core Engineering Highlights

    • Architectural Efficiency: The ASMBL architecture allows for a highly uniform distribution of logic, memory, and DSP columns. This reduces routing congestion, a critical advantage when designing high-utilization systems that exceed 80% logic occupancy.

    • Rich Memory Hierarchy: Fitur 4,320 Kb of Block RAM (BRAM). This dual-port memory resources are essential for implementing deep data buffers, localized caching, and high-speed FIFO structures required in streaming video or networking applications.

    • Massive I/O Connectivity: Housed in the FF1148 Flip-Chip BGA package, the device breaks out 768 User I/Os. This allows for the simultaneous management of high-width parallel buses, such as dual-bank DDR2 or QDR-II interfaces, without pin-count bottlenecks.

    • XtremeDSP™ Performance: Integrated with 96 dedicated DSP48 slices. These hard-coded arithmetic blocks handle 18×18 bit multiplications and MAC functions at hardware speeds, freeing up standard logic for control plane tasks.

    • Precision Clocking (DCM): Equipped with advanced Digital Clock Managers for sub-nanosecond skew control and frequency synthesis, ensuring stable synchronization across complex, multi-clock domain designs.


    Technical Specification Matrix

    FiturSpesifikasi
    Sel Logika110,592
    CLB Array12,480
    Total Block RAM4,320 Kb
    DSP48 Slices96
    User I/Os768
    Tingkat Kecepatan-10 (Standard Performance)
    Temperature GradeKomersial (0°C hingga +85°C)
    PaketFF1148 (Flip-Chip BGA)

    Hardware Architect’s Perspective: Why Specify the LX100-10C?

    1. Predictable Timing Closure

    One of the primary reasons engineers stay with the Virtex-4 LX100 is its predictable routing fabric. Unlike newer, more congested architectures, the LX100 provides consistent timing models that allow for faster design iterations and “right-the-first-time” silicon behavior.

    2. Superior Signal Integrity

    The FF1148 Flip-Chip package is specifically designed to minimize parasitic inductance. With a dense distribution of VCC and GND pins, it suppresses Simultaneous Switching Noise (SSN), ensuring clean signal eyes for high-speed differential pairs (LVDS/HSTL).

    3. Maturity and Stability

    For commercial products with long lifecycles—such as medical imaging backplanes or high-end broadcasting gear—the LX100-10C offers a proven track record of field reliability and a well-documented toolchain, reducing the risk of unexpected architectural bugs.


    Ideal Use Cases

    • Broadcasting: Real-time format conversion and professional-grade video switching.

    • Medical Systems: Advanced MRI data acquisition and real-time image reconstruction.

    • Test & Measurement: Logic analyzer front-ends and high-speed pattern generation.

    • Communications: High-speed protocol conversion and localized switching fabrics.