Spesifikasi
KLMAG1JETD-B041 is a 16GB embedded flash memory IC manufactured by Samsung Semiconductor, fully compliant with JEDEC eMMC 5.1 industry standard. It integrates MLC NAND flash array and dedicated embedded storage controller inside one single package, serving as onboard persistent storage for mobile terminals and embedded intelligent equipment.
Part Number Definition
KLMAG series belongs to Samsung mainstream eMMC embedded flash product lineup. The middle character string defines 16GB effective storage capacity and internal die stacking structure. B041 represents fixed hardware revision, electrical parameter specification and packaging specification. Original factory adopts tape-and-reel packaging by default to support automatic SMT mounting on PCB for mass production.
Core Storage and Interface Performance
The chip features 16GB user available storage space with 2-bit MLC flash particle architecture. It supports HS400 high-speed transmission mode with maximum theoretical interface bandwidth up to 400MB/s. Typical sequential reading speed reaches 250~330MB/s, and sequential writing speed ranges from 50MB/s to 120MB/s. The built-in controller automatically executes wear leveling algorithm, bad block detection and replacement, hardware ECC error correction, garbage collection and partition management, shielding underlying NAND operation logic from main processors and reducing development difficulty on host side. It supports multi-partition division, secure data erasure, sanitize operation and controller firmware online upgrade.
Power Supply Design
Dual voltage power supply structure is adopted. Flash core array works under 3.3V voltage, while controller and signal I/O interface support optional 1.8V or 3.3V working voltage to match IO electrical levels of various main control SoCs. Multiple low-power modes including deep sleep and power-off notification are embedded to lower power consumption during standby and idle state, which fits battery-powered portable devices and low-power IoT terminals perfectly.
Package and Mechanical Parameters
Packaging type is 153-ball FBGA fine pitch ball grid array package, with overall dimension 11.5mm × 13mm × 0.8mm. Moisture Sensitivity Level is MSL 3, and reflow soldering must be finished within 168 hours after opening vacuum moisture-proof packaging. Standard ball layout guarantees stable soldering reliability in batch PCB assembly.
Environmental and Compliance Standards
Standard working temperature range is -25℃ to +85℃, suitable for consumer electronics and conventional industrial embedded equipment. The product is produced with lead-free manufacturing process and fully meets RoHS and REACH environmental protection regulations without restricted hazardous substances. Optimized internal circuit layout improves anti-electromagnetic interference ability to ensure stable data read and write under complex circuit environments.
Skenario Aplikasi Umum
Smartphones, tablets and portable Android intelligent terminal built-in system storage RK series embedded development boards, commercial advertising machines, display screens and industrial touch HMI firmware storage POS payment terminals, self-service equipment, vending machines and access control main controller local storage Smart TV, IPTV set-top boxes, vehicle infotainment hosts and edge IoT gateway data storage Front-end video monitoring equipment, miniature NVR devices and handheld testing instruments program and parameter storage
LXB Semicon supplies original Samsung KLMAG1JETD-B041 16GB eMMC 5.1 flash memory integrated circuit
