| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xcku3p-3ffvvb676e | Kintex® UltraScale+ | 20,34 | -3,00 | 355,950 جنيهاً مصرياً | 31,641,600,600 بت | 0 | ~0.85 V | التركيب على السطح | 0 درجة مئوية - 100 درجة مئوية | FCBGA-676 | 676-FCBGA (27×27) |
xcku3p-3ffvvb676e
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 3,780,000
شرائح المنطق: 590,000
ذاكرة الوصول العشوائي المدمجة (eRAM): 81,360 Kb (2,260 × 36Kb Block RAM)
الحد الأقصى لإدخال/إخراج المستخدم: 350
الحزمة: FFFVVB676 (رقاقة الوجه BGA)
درجة السرعة: -3
درجة حرارة التشغيل: ممتد (من 0 درجة مئوية إلى +100 درجة مئوية)
المواصفات
تفصيل أرقام القطع
This is AMD Xilinx Kintex UltraScale+ family low-power FPGA fabricated on 16nm FinFET process, designed for embedded signal processing, portable instruments and extreme temperature industrial devices.
- XCKU3P: Entry-level member of Kintex UltraScale+ P-series with built-in UltraRAM on-chip large memory
- -3: Speed Grade 3, power-optimized grade, prioritizes power efficiency over maximum operating frequency
- FFVB676: 676-ball flip-chip FCBGA compact package
- E: Extended industrial temperature grade, junction temperature operating range: -40°C ~ +125°C
موارد الأجهزة المدمجة في الرقاقة
Logic and DSP Resources
- Total Logic Cells: 221280
- DSP48E2 dedicated arithmetic blocks: 1128 units
Used for digital filtering, FFT calculation, sensor data processing, lightweight image algorithms and small-scale matrix operations
الذاكرة المدمجة
- Total Block RAM: 14.5 Mb
- On-chip UltraRAM: 13.5 Mb, suitable for image frame buffering, deep data caching and large algorithm intermediate storage
- LUT-based distributed RAM for ultra-low latency temporary data storage
Clock Management System
Multiple MMCM and PLL clock management tiles are integrated. It supports clock frequency multiplication/division, arbitrary phase adjustment and jitter attenuation to meet timing requirements of multi-clock digital systems
High-Speed Transceivers & I/O Interfaces
- 8 GTH high-speed serial transceivers, maximum single lane rate up to 16.375 Gbps
Supported protocols: PCIe Gen3, 10G Ethernet, JESD204B/C, Aurora
- Available user I/O pins: 280
Equipped with HR wide-voltage I/O banks and HP high-speed I/O banks, compatible with LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- Built-in SYSMON module: Real-time monitoring of chip internal temperature, power supply voltages and external analog input signals
مواصفات مصدر الطاقة
Nominal core operating voltage: 0.85 V
Independent power domains are configured for core logic, memory modules, transceivers and I/O interfaces. Dynamic voltage and frequency scaling can be enabled to reduce power consumption under light loads.
Typical overall power consumption: 8W ~ 27W, passive heat dissipation is applicable for miniature compact embedded devices
Packaging and Assembly Requirements
- Package: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; reflow soldering must be completed within 168 hours after opening vacuum packaging
- Lead-free design, fully compliant with RoHS environmental standards
- معبأة في صواني مقاومة للكهرباء الساكنة من أجل الإنتاج الصناعي الآلي للوحات الدوائر المطبوعة (PCB) بكميات كبيرة
Reliability & Environmental Performance
It can run stably for a long time under extreme temperature changes and strong electromagnetic interference environments.
Supports 256-bit AES bitstream encryption for IP protection, SEU single-event upset error correction and partial dynamic reconfiguration, meeting the high stability requirements of automotive electronics, outdoor industrial equipment and portable airborne terminals.
سيناريوهات التطبيق النموذجية
- Handheld software-defined radio, miniature wireless baseband signal preprocessing modules
- Portable multi-channel data recorders, vibration monitoring terminals and handheld precision measuring instruments
- Miniature short-range radar front-end signal acquisition and echo processing boards
- Vehicle-mounted video preprocessing units and automotive peripheral control modules
- Field portable industrial visual inspection equipment
- Low-power PCIe data acquisition cards and custom embedded core carrier boards
