| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc6vsx475t-1ffg1759c | Virtex-6 SXT | 37.200,00 | -1,00 | 476,160 | 39223296 | 840 | 0.95-1.05 V | التركيب على السطح | 0 درجة مئوية ~ 85 درجة مئوية (TJ) | 1759-BBGA, FCCBGA, 1759-BBGA | 1759-FCBGA |
xc6vsx475t-1ffg1759c
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 476,160
شرائح المنطق: 74,400
ذاكرة الوصول العشوائي المدمجة (eRAM): 38,304 Kb (2,128 × 18Kb Block RAM)
الحد الأقصى لإدخال/إخراج المستخدم: 600
الحزمة: FFG1759 (Flip-Chip BGA)
درجة السرعة: -1
درجة حرارة التشغيل: تجاري (0 درجة مئوية إلى +85 درجة مئوية)
المواصفات
تعريف رقم القطعة
This commercial temperature grade high-performance FPGA belongs to Xilinx Virtex-6 SXT family, fabricated on mature 40nm CMOS low-power semiconductor process. The SXT variant is optimized intensively for digital signal processing computing capacity, high-speed serial transmission bandwidth and on-chip memory resources, oriented to stationary indoor high-speed signal processing platforms, radar intermediate frequency acquisition equipment, communication baseband development systems and high-end data recording devices working under stable room temperature environments.
- XC6VSX475T: Large-capacity flagship model of Virtex-6 SXT lineup, equipped with abundant DSP arithmetic units and block RAM resources, the optimal choice for massive floating-point fixed-point computing and broadband signal processing scenarios
- -1: Speed Grade 1, low-power timing specification. Power consumption control and thermal stability are prioritized over maximum operating frequency, suitable for long-term continuously running high-performance embedded equipment with moderate heat dissipation conditions
- FFG1759: 1759-ball flip-chip FCBGA package, physical dimension 42.5mm × 42.5mm, ball pitch 1mm. Ultra-abundant ball pins fully accommodate all integrated GTX high-speed transceivers, multi-standard general I/O banks and multi-channel large-capacity DDR3/QDRII SRAM memory interfaces, with outstanding signal integrity and thermal dissipation performanceAlibaba.co…
- C: Commercial temperature grade, continuous junction temperature operating range: 0°C ~ +85°CMicro-Semi…
معلمات موارد الأجهزة المدمجة في الرقاقة
1. Programmable Logic Resources
- Total System Logic Cells: 476,160
- Configurable CLB Slices: 74,400
- Total Flip-Flops: 1,488,000
- Total LUT Lookup Tables: 744,000
- Distributed RAM Capacity: 7.64 Mb
2. Arithmetic & Embedded Memory Resources
- DSP48E2 arithmetic slices: 2,016 units, specially optimized for multi-channel FFT calculation, radar pulse compression, wireless communication MIMO baseband demodulation, beamforming and high-precision cryptographic algorithm acceleration
- Total Block RAM Capacity: 38.30 Mb, composed of independent 36Kb RAM blocks, used for waveform raw data caching, deep FIFO buffering, filter coefficient storage and large-capacity on-chip frame buffering
3. Clock Management Subsystem
- 18 CMT clock management tiles (each CMT contains 1 MMCM + 1 PLL)
Multiple mutually independent clock domains can be configured flexibly. The module supports ultra-low jitter clock generation, precise phase shifting and multi-path delay compensation, meeting strict timing requirements of multi-clock heterogeneous high-speed digital systems
4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة
- 36 GTX differential high-speed serial transceivers
Maximum single-lane transmission rate reaches 6.25 Gbps, compatible with PCIe Gen2, Aurora, JESD204, RapidIO and mainstream broadband serial communication protocols. Built-in physical layer hard controllers simplify high-bandwidth data interconnection design between boards and chips
5. واجهات الإدخال/الإخراج ووحدة المراقبة المدمجة في الرقاقة
- Total configurable user I/O pins: 840
Multiple I/O voltage banks support 1.2V~3.3V wide voltage range, fully compatible with LVCMOS, LVDS, differential HSTL, SSTL and all mainstream single-ended/differential industrial signal standards
Built-in dual-channel XADC analog monitoring module tracks chip junction temperature, internal core supply voltages and external analog input signals in real time continuously
Power Supply Characteristics
Core operating voltage range: 0.95V ~ 1.05V. Logic fabric, block RAM, DSP arrays and serial transceivers are divided into independent power domains, supporting partial module power shutdown to dynamically adjust overall power dissipation
Typical total power consumption range: 17W ~ 45W. Stable full-load operation at the upper commercial temperature limit requires forced air cooling configuration
Packaging and SMT Assembly Specifications
- Package Form: 1759-pin Flip-Chip BGA
- Moisture Sensitivity Level: MSL4, all reflow soldering operations must be completed within 72 hours after vacuum packaging is opened
- Non-RoHS compliant (contains lead components)
- Devices are stored and transported in anti-static trays to avoid electrostatic damage during PCB assembly production
Environmental Adaptability and Operational Reliability
This chip is designed exclusively for indoor constant-temperature working environments. It operates stably under mild temperature fluctuations, slight mechanical vibration and conventional electromagnetic interference. It supports bitstream AES encryption, dynamic partial reconfiguration and SEU single-event upset detection and correction, without anti-radiation reinforcement design, and cannot adapt to outdoor low-temperature, vehicle-mounted vibration and aerospace harsh working conditions
سيناريوهات التطبيق النموذجية
- Indoor radar signal processing motherboards, broadband satellite communication receiving baseband platforms deployed in laboratories
- High-precision multi-channel arbitrary waveform generators and ultra-wideband signal analyzers for electronic research institutes
- Large-capacity high-speed data recording equipment and multi-channel synchronous acquisition systems
- Wireless communication algorithm verification platforms and digital intermediate frequency hardware simulation systems
- High-end industrial real-time high-resolution image processing and multi-beam sonar signal decoding equipment
