| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX25-11SFG363I | Virtex-4 SX | 2.688,00 | -11,00 | 24192 عناصر المنطق | 1,327,104 بت | 240 | 1.14 فولت ~ 1.26 فولت | التركيب على السطح | صناعي (-40 درجة مئوية إلى +100 درجة مئوية تحت الصفر) | 363-FBGA, FCBGA 363 | 363-FCBGA (17×17) |
XC4VLX25-11SFG363I: High-Speed Virtex-4 LX in a Compact SF363 Footprint
إن XC4VLX25-11SFG363I is a logic-optimized FPGA designed for applications requiring high-density CLBs in a space-constrained form factor. By utilizing the SF363 (17x17mm) small-form-factor BGA, this device provides the processing power of the Virtex-4 LX architecture without the footprint overhead of the larger 668-pin packages.
This specific variant is binned for the -11 speed grade و Industrial temperature range, making it a critical component for aerospace, ruggedized industrial compute, and tactical communication systems where thermal swings from $-40°C$ to $+100°C$ are expected.
Technical Core Specifications
الخلايا المنطقية: 24,192
CLB Array: 48 x 72
Block RAM: 1,296 Kb (organized as 18 Kb blocks)
DSP48 Slices: 48
Maximum User I/O: 240 (Reduced compared to FFG668 due to package size)
الحزمة: SFG363 (17mm x 17mm, 0.8mm pitch, Lead-Free/RoHS)
درجة السرعة: -11 (Mid-to-high performance)
درجة حرارة التشغيل: Industrial ($-40°C$ to $+100°C$)
Hardware Design Considerations
1. Pin Density & Routing
The SF363 package uses a 0.8mm ball pitch. Unlike the 1.0mm pitch found in larger Virtex-4 parts, the SF363 requires tighter PCB design rules. Engineers should ensure their fabrication house can handle the required via-in-pad or fine-line traces necessary to breakout the inner rows of the 363-ball grid.
2. Thermal Management in Industrial Enclosures
With an Industrial rating ($100°C$ max junction), this part is rugged. However, the smaller 17x17mm package has a higher thermal resistance ($\theta_{JA}$) than the larger FFG668. If your design is hitting high logic utilization at -11 speeds, pay close attention to the thermal dissipation path through the PCB ground planes.
3. Timing Slack & Migration
The -11 speed grade is often specified to resolve setup time ($T_{su}$) bottlenecks in high-speed memory interfaces or custom LVDS backplanes. When replacing an older -10 grade part with this -11 variant, verify that your hold time ($T_h$) margins remain valid in your ISE timing reports.
Legacy Tooling & Software Support
As with the entire Virtex-4 series, the XC4VLX25-11SFG363I is supported by Xilinx ISE Design Suite (14.7). It is لا compatible with Vivado. If you are maintaining a legacy system, ensure your design environment is locked to ISE to maintain bitstream integrity.
Comparison: SFG363 vs. FFG668 Package (LX25)
| المعلمة | XC4VLX25-11SFG363I | xc4vlx25-11ffg668i |
| Package Dimensions | 17mm x 17mm | 27mm x 27mm |
| Ball Pitch | 0.8mm | 1.0mm |
| Available I/O | 240 | 448 |
| Logic/RAM/DSP | Identical | Identical |
Engineering FAQ
Can I drop this into a board designed for the commercial ‘C’ grade? Yes. The ‘I’ grade is a superior replacement for the ‘C’ grade, offering a wider temperature window. The electrical characteristics and bitstream compatibility remain identical.
Why is the I/O count lower on the SFG363? The silicon die is the same, but the SF363 package is “I/O limited.” Many of the LX25’s internal signals are not bonded out to pins to maintain the smaller footprint. Always verify your .ucf pin assignments against the SF363 pinout map.
Is this part RoHS compliant? Yes, the “G” in SFG363 denotes a Lead-Free (RoHS) package. This is essential for modern compliance, even when maintaining legacy equipment.
Need a Certificate of Conformance (CoC) or a specialized quote for a production run? We focus on providing traceable, high-reliability Xilinx parts for systems that cannot afford downtime.
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