| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc4vlx15-10sfg363c | Virtex-4 LX | 1.536,00 | -10,00 | 13824 | 884736 | 240 | 1.14 فولت ~ 1.26 فولت | التركيب على السطح | 0 °C ~ +85 °C (Commercial) | 363-FCBGA | 363-FCBGA |
XC4VLX15-10SFG363C: Optimized Logic Density in a Compact Footprint
إن xc4vlx15-10sfg363c is the entry-point powerhouse of the Virtex®-4 LX family, designed for applications where PCB real estate is at a premium but high-performance FPGA logic is non-negotiable. Utilizing the 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device delivers a lean, high-speed logic fabric in a compact SFG363 fine-pitch BGA package.
This Commercial-grade (0°C to +85°C) device with a -10 speed grade is the ideal choice for “glue logic” integration, protocol bridging, and localized signal processing.
Core Engineering Highlights
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Compact SFG363 Packaging: The 363-pin Fine-pitch BGA (0.8mm pitch) allows for high-density routing on smaller PCBs, making it perfect for handheld instrumentation and modular daughtercards.
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Performance-to-Size Ratio: Despite its small footprint, it packs 13,824 Logic Cells و 864 Kb of Block RAM, providing enough “brainpower” to manage complex system-level tasks that typically overwhelm smaller CPLDs or entry-level FPGAs.
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Lead-Free (RoHS) Compliance: إن “SFG” designation indicates a fully green, lead-free package, ensuring your design meets global environmental regulatory standards for commercial electronics.
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XtremeDSP™ Capability: Equipped with 32 dedicated DSP48 slices. This is a significant advantage for engineers needing to implement hardware-accelerated math, such as digital filtering or PID control loops, without consuming standard logic resources.
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SelectIO™ Versatility: Supports up to 240 User I/Os, compatible with a wide array of single-ended and differential signaling standards (LVDS, HSTL, SSTL), facilitating easy communication with modern high-speed peripherals.
Technical Specification Matrix
| الميزة | المواصفات |
| الخلايا المنطقية | 13,824 |
| Total Block RAM | 864 Kb |
| DSP48 Slices | 32 |
| Max User I/O | 240 |
| درجة السرعة | -10 (Standard) |
| درجة الحرارة | تجاري (0 درجة مئوية إلى +85 درجة مئوية) |
| الحزمة | SFG363 (Lead-Free Fine-pitch BGA) |
| الجهد الأساسي | 1.2V |
Why Specify the LX15-10SFG363C?
1. Precision Timing & Clocking
Even at the entry-level of the Virtex-4 family, you get access to Digital Clock Managers (DCMs). This allows for precise clock synthesis and phase shifting, which is critical for synchronizing data in multi-chip systems or managing high-speed serial interfaces.
2. Thermal & Power Efficiency
The 1.2V core voltage and optimized 90nm process keep static power consumption low. In the SFG363 package, the thermal dissipation is highly manageable, often eliminating the need for dedicated heatsinks in well-ventilated commercial enclosures.
3. Architectural Consistency
Using the LX15 allows you to stay within the Virtex-4 ecosystem. If your design grows, the code is easily portable to larger LX parts, saving significant time in RTL migration and verification.
Typical Deployment
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الأنظمة المدمجة: High-speed peripheral expansion and bus bridging.
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Consumer Electronics: Digital video processing and display interface driving.
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Medical Devices: Portable diagnostic equipment and sensor data aggregation.
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Communications: Line card control plane processing and low-latency packet filtering.
