Thông số kỹ thuật
KLMAG1JETD-B041 is a 16GB embedded flash storage chip manufactured by Samsung Semiconductor, fully compliant with eMMC 5.1 JEDEC standard, integrating MLC NAND flash and dedicated flash management controller inside a single BGA package, designed for embedded equipment to provide stable built-in system storage.
Part Number Definition
KLMAG series stands for Samsung mainstream eMMC storage product line. The middle code defines 16GB storage density and internal die stacking configuration. B041 represents the official version specification, packaging mode and production revision. The factory adopts tape-and-reel packaging by default to support automatic SMT mounting on PCB boards.
Core Storage & Interface Specifications
Total effective storage capacity is 16GB, adopting 2bit MLC flash particle architecture. It supports HS400 high-speed transmission mode with theoretical maximum bandwidth up to 400MB/s. Actual sequential read speed can reach around 250~330MB/s, and sequential write speed hits about 50~120MB/s. The built-in controller autonomously completes wear leveling, bad block marking, hardware ECC error correction and garbage collection work, which shields NAND flash bottom-layer management logic from main processors and simplifies host-side software development difficulty. It follows standard MMC bus communication protocol and can be directly matched with mainstream embedded SoC and MCU with eMMC host interface.
Power Supply Working Conditions
It uses dual voltage power supply design. VCC for flash array adopts 3.3V power supply, and VCCQ for controller and signal I/O supports optional 1.8V or 3.3V voltage input, which can flexibly adapt to different main control chip IO electrical standards. Multiple low-power dormant and power-off modes are embedded to reduce power consumption during standby and idle periods, fitting battery-powered portable devices.
Package and Mechanical Parameters
Package type is 153-ball FBGA fine pitch ball grid array packaging, with overall dimension 11.5mm × 13mm × 0.8mm, featuring ultra-thin thickness to save PCB layout space. Moisture Sensitivity Level is MSL 3, and reflow soldering needs to be finished within 168 hours after opening vacuum moisture-proof packaging. The ball layout is standardized with stable soldering performance for mass production assembly.
Environmental and Compliance Standards
Standard operating temperature range is -25℃ to +85℃, meeting the working requirements of consumer electronics and conventional industrial embedded equipment. The whole product is lead-free manufactured and fully conforms to RoHS and REACH environmental protection regulations without restricted hazardous substances. Optimized anti-interference design ensures stable data reading and writing under conventional electromagnetic environment.
Các lĩnh vực ứng dụng điển hình
Smartphones, tablet computers and portable Android intelligent terminal built-in system storage RK series embedded development boards, advertising machines, commercial display equipment and industrial touch control host firmware storage POS payment terminals, self-service equipment, intelligent vending machines and access control main controller local storage Smart TV, set-top boxes, vehicle-mounted infotainment host and small IoT edge gateway data storage Monitoring front-end acquisition equipment, miniature NVR equipment and handheld measuring instrument program and data storage
LXB Semicon supplies original Samsung KLMAG1JETD-B041 16GB eMMC 5.1 flash memory IC
