| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VLX50-2FFG676I | Virtex-5 LX | 3,60 | -2,00 | 46080 | 1769472 | 440 | 0.95 V – 1.05 V | Yüzey Montajı | -40 °C – +100 °C (I) | 676-FBGA / FCBGA | 676-FCBGA (≈27 × 27 mm) |
XC5VLX50-2FFG676I
Üretici firma: Xilinx Mantık Hücreleri: 51,840 Mantık Dilimleri: 8,160 Gömülü RAM (eRAM): 2,448 Kb (136 × 18Kb Block RAM) Paket: FFG676 (Flip-Chip BGA) Çalışma Sıcaklığı: Endüstriyel (-40°C ila +100°C)
Teknik Özellikler
XC5VLX50-2FFG676I delivers higher speed performance for industrial applications requiring better timing and reliability.
Temel Özellikler
- Speed grade -2 (faster performance)
- Industrial-grade reliability
- Optimized for signal processing
Technical Specifications
- Package: FFG676
- Speed Grade: -2
- Temperature: -40°C to +100°C
Cross Reference
- XC5VLX50-1FFG676I
- XC5VLX50-2FFG676C
Uygulamalar
- High-speed data processing
- Industrial controllers
- DSP systems
Stock Availability
⚠️ Low stock – high demand item
🚀 Ready for immediate dispatch
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