| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX60-10FFG668I | Virtex-4 SX | 0,00 | 0,00 | — | — | 448 | — | — | — | 668-FBGA / FCBGA | — |
XC4VLX60-10FFG668I: High-Density Virtex-4 LX for Industrial Logic Applications
Bu XC4VLX60-10FFG668I is a high-capacity FPGA designed for logic-intensive workloads within the Virtex-4 platform. With 59,904 logic cells, it offers more than double the logic resources of the LX25, making it the preferred choice for designs requiring complex state machines, large-scale bus bridging, or significant I/O expansion.
This specific variant features the -10 speed grade and is binned for Industrial temperature range, ensuring stable performance in thermally volatile environments where standard commercial silicon may drift out of spec.
Core Technical Specifications
Mantık Hücreleri: 59,904
CLB Array: 64 x 96
Total Block RAM: 2,880 Kb
DSP48 Slices: 64
Maximum User I/O: 448
Paket: FFG668 (Fine-pitch Flip-Chip BGA, 1.0mm pitch, RoHS)
Hız derecesi: -10
Temperature Grade: Industrial ($-40°C$ to $+100°C$)
Engineering Integration & Hardware Notes
1. Power Distribution Network (PDN) Requirements
The LX60’s increased logic density over smaller Virtex-4 parts means higher static and dynamic power consumption. Engineers must ensure the 1.2V $V_{CCINT}$ rail is sufficiently decoupled. Given the 90nm architecture’s leakage characteristics at the Industrial temperature limit ($100°C$), your thermal solution must be capable of dissipating the increased $T_{junction}$ heat to prevent timing degradation.
2. Configuration & I/O Banking
The FFG668 package provides a robust 448 user I/Os. When assigning pins in your .ucf file, pay close attention to the bank-specific $V_{CCO}$ requirements. The Virtex-4 SelectIO technology supports a wide range of standards (LVDS, HSTL, SSTL), but banking rules are strict—mixing incompatible I/O voltages within a single bank will lead to hardware failure or bitstream errors.
3. Legacy Tooling Lifecycle
The XC4VLX60 is not supported by Vivado. You must use Xilinx ISE Design Suite (14.7). For teams maintaining legacy codebases, ensure that your synthesis settings account for the LX60’s specific routing architecture to achieve timing closure, especially if the logic utilization exceeds 80%.
Comparison: Virtex-4 LX60 vs. LX40
| Özellik | XC4VLX60-10FFG668I | XC4VLX40-10FFG668I |
| Mantık Hücreleri | 59,904 | 41,472 |
| Blok RAM | 2,880 Kb | 1,728 Kb |
| DSP48 Slices | 64 | 64 |
| Paket | FFG668 (1.0mm) | FFG668 (1.0mm) |
Hardware Engineer’s FAQ
Can I replace an XC4VLX60-10FFG668C with this Industrial ‘I’ grade part?
Yes. The ‘I’ grade is a drop-in, superior replacement for the ‘C’ (Commercial) grade. It maintains the same electrical characteristics and timing models while extending the operational temperature window.
What is the advantage of the FFG668 package for the LX60?
The “FF” (Flip-Chip) package provides significantly lower lead inductance compared to wire-bond alternatives. For the LX60, this is crucial for maintaining signal integrity across the 448 user I/Os, especially when switching high-speed differential signals.
Is this part RoHS compliant?
Yes, the “G” in FFG668 indicates Lead-Free/RoHS compliance. If your assembly process requires leaded solder, ensure your reflow profile is adjusted for the higher melting point of the lead-free SAC305 balls on the component.
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