XC4VSX35-10FFG668I

Производитель: AMD / Xilinx
Логические ячейки: 55,296
Логические срезы: 6,144
Встроенная оперативная память (eRAM): 5 898 240 бит
Упаковка: FCPBGA-1148 (27 × 27 мм)
Рабочая температура:От 40°C до +100°C (промышленный)

ОТПРАВИТЬ НАМ СООБЩЕНИЕ

    Технические характеристики

    МОДЕЛЬ П/НСЕРИИКОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБУРОВЕНЬ СКОРОСТИКОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕКВСЕГО БИТОВ ОЗУКОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВНАПРЯЖЕНИЕ - ПИТАНИЕТИП КРЕПЛЕНИЯРАБОЧАЯ ТЕМПЕРАТУРАУПАКОВКА / КЕЙСУПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА
    XC4VSX35-10FFG668IVirtex-4 SX4,36-10,0034 848 логических ячеек3 168 Кбитс3201,14 В ~ 1,26 ВSMDПромышленные (-40°C ~ +100°C)668-BGAFFG668

    XC4VSX35-10FFG668I Xilinx Virtex-4 SX FPGA – Industrial Grade DSP Processing Device

    Сайт XC4VSX35-10FFG668I is a DSP-oriented FPGA from the Xilinx Virtex-4 SX family, designed for applications that require stable real-time signal processing and operation across extended temperature ranges.

    Unlike general-purpose logic-focused devices, the Virtex-4 SX series is optimized around DSP48 slices, making this part especially suitable for filtering, modulation, FFT acceleration, and other compute-heavy data path workloads. The industrial temperature rating and compact FFG668 package make it a practical choice for embedded and industrial platforms with limited board space.

    Key Specifications Overview

    • Part Number: XC4VSX35-10FFG668I

    • Семейство FPGA: Xilinx Virtex-4 SX Series

    • Класс скорости: -10

    • Тип упаковки: FFG668 Flip-Chip BGA

    • Temperature Grade: Industrial (-40°C to +100°C junction)

    • DSP Resources: Integrated DSP48 slices for high-throughput processing

    • Target Workload: Signal processing and data-intensive applications

    Типовые применения

    In real engineering projects, the XC4VSX35-10FFG668I is commonly deployed in:

    • Industrial communication equipment

    • Платформы программно-определяемого радио (SDR)

    • Data acquisition and measurement systems

    • Machine vision and industrial imaging

    • Motion control and automation controllers

    • Embedded video processing modules

    This device is usually selected when DSP performance and thermal reliability are more critical than maximum logic density.

    Design and Integration Considerations

    The FFG668 package provides a balanced I/O count that supports external memory interfaces, parallel ADC/DAC connections, and multiple high-speed peripheral buses while keeping PCB complexity under control.

    Virtex-4 remains a mature FPGA platform with stable tool support and well-documented design resources. For legacy system maintenance and long-term industrial products, this part offers predictable behavior and consistent performance across temperature extremes.

    Supply Status and Procurement Notes

    The XC4VSX35-10FFG668I is classified as a legacy FPGA device, and availability depends on specialized inventory channels and long-term stock programs.

    When sourcing this part, engineers and procurement teams typically check:

    • Original manufacturer packaging and labeling

    • Date code and lot traceability

    • Industrial temperature marking

    • Moisture sensitivity level (MSL) compliance

    • Proper storage and handling conditions

    Early sourcing is recommended for production programs and maintenance projects to avoid unexpected lead-time issues.

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