| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX160-10FFG1148I | Virtex-4 LX | 16.896,00 | -10,00 | 152 064 LE | 5 308 416 бит ≈ 5,31 Мбит | 768 | 1,14 V ~ 1,26 V | Монтаж на поверхность | Промышленные (-40°C ~ +100°C) | 1148-BBGA, FCBGA | 1148-FCPBGA (35×35) |
XC4VLX160-10FFG1148I: High-Density Virtex-4 LX Logic Platform
Сайт XC4VLX160-10FFG1148I is the highest-capacity member of the logic-optimized Virtex-4 LX family. With 152,064 logic cells, it provides a massive fabric for complex system integration and parallel data processing. The -10 speed grade provides a reliable performance baseline, while the Industrial temperature rating ($T_j = -40°C$ to $+100°C$) ensures operation in rugged environments where commercial-grade silicon fails to meet thermal stability requirements.
Core Technical Specifications
Логические ячейки: 152,064
CLB Array: 128 x 104
Block RAM: 5,184 Kb (18 Kb blocks)
DSP48 Slices: 96
Max User I/O: 768
Упаковка: FFG1148 (35mm x 35mm, 1.0mm pitch Flip-Chip BGA)
Класс скорости: -10
Temperature Grade: Industrial ($-40°C$ to $+100°C$)
Hardware Engineering Considerations
1. Power Supply and Thermal Management
The LX160 is a significant consumer of power. On the 90nm process, static leakage increases significantly as the junction temperature approaches the $100°C$ industrial limit.
$V_{CCINT}$ Requirements: Ensure the 1.2V core supply is rated for high transient currents.
Dissipation: Given the 35mm FFG1148 package size, a high-quality thermal interface material (TIM) and robust heatsinking are mandatory to manage the power density of 152k logic cells switching at speed.
2. Signal Integrity for 768 I/O Pins
With 768 user I/Os available, signal integrity and Simultaneous Switching Output (SSO) management are critical.
Banking: Verify that $V_{CCO}$ levels for each of the multiple I/O banks are correctly assigned to match your LVDS, SSTL, or HSTL requirements.
Decoupling: High-speed switching on this many pins requires a precise decoupling capacitor matrix located as close as possible to the BGA vias to suppress ground bounce.
3. Legacy Toolchain Support
The XC4VLX160 is not supported by Xilinx Vivado. Maintenance and bitstream generation must be performed using Xilinx ISE Design Suite 14.7. For engineers retrieving archived projects, ensure that timing constraints (.ucf) are validated against the -10 speed grade models to ensure setup/hold margins are met.
Comparison: Virtex-4 LX160 vs. LX100
| Характеристика | XC4VLX160-10FFG1148I | XC4VLX100-10FFG1148I |
| Логические ячейки | 152,064 | 110,592 |
| Block RAM (Kb) | 5,184 | 4,320 |
| DSP48 Slices | 96 | 96 |
| I/O Count | 768 | 768 |
Engineering FAQ
Is the XC4VLX160-10FFG1148I a drop-in replacement for the Commercial (-10FFG1148C)?
Yes. The Industrial ‘I’ grade is a superior replacement. It covers the full commercial temperature range and extends it. Electrical parameters and bitstream compatibility are identical.
Why is the FFG1148 package used for this density?
The “FF” (Flip-Chip) BGA offers lower package inductance and better thermal conductivity than wire-bonded packages. The 1.0mm pitch provides enough escape routing for the 768 I/Os while maintaining a manageable 35mm footprint.
What is the status of the configuration memory?
The Virtex-4 uses SRAM-based configuration. For high-reliability industrial use, ensure your configuration flash and CCLK frequency are optimized for the bitstream size of the LX160, which is significantly larger than the LX25 or LX60 variants.
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