| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX15-11SFG363C | Virtex-4 LX | 1.536,00 | -11,00 | 13824 | 884736 | 240 | 1,14 V ~ 1,26 V | Монтаж на поверхность | 0 °C ~ +85 °C (Commercial) | 363-FCBGA | 363-FCBGA |
XC4VLX15-11SFG363C: High-Speed Logic Performance in a Small-Form-Factor Package
Сайт XC4VLX15-11SFG363C is a high-performance, lead-free FPGA from Xilinx’s Virtex®-4 LX family. By pairing the -11 speed grade—the faster tier for this series—with the compact SFG363 fine-pitch BGA footprint, this device is engineered for applications that demand tight timing closures and high clock frequencies without the PCB real estate overhead of larger packages.
Designed for Commercial-grade (0°C to +85°C) environments, this FPGA provides the architectural robustness of the Virtex-4 line in a lean, efficient profile.
Engineering Performance Highlights
Optimized Timing (-11 Speed Grade): The -11 grade offers significantly reduced propagation delays and faster switching speeds compared to standard -10 models. This is critical for engineers implementing high-speed memory interfaces or high-bandwidth data paths that require extra timing slack.
Compact SFG363 Footprint: The 17mm x 17mm fine-pitch (0.8mm) BGA package is ideal for multi-layer PCBs where space is at a premium, such as PCIe half-cards, mezzanine modules, and handheld instrumentation.
Advanced Logic Fabric: With 13,824 Logic Cells и 864 Kb of Block RAM, the LX15 provides a sophisticated environment for complex state machines, protocol conversion, and “glue logic” consolidation.
Hardened DSP Resources: Despite its small size, it features 32 XtremeDSP™ slices. These dedicated DSP48 blocks allow for high-speed arithmetic operations (up to 400MHz+) without taxing the general-purpose logic fabric.
RoHS Compliant (SFG): The lead-free packaging ensures full compliance with global environmental standards, making it suitable for modern commercial electronic production.
Technical Specification Matrix
| Характеристика | Технические характеристики |
| Логические ячейки | 13,824 |
| CLB Array | 1,536 |
| Total Block RAM | 864 Kb |
| DSP48 Slices | 32 |
| Max User I/O | 240 |
| Степень скорости | -11 (High Performance) |
| Temperature Grade | Коммерческий (от 0°C до +85°C) |
| Пакет | SFG363 (Lead-Free / 0.8mm Pitch) |
Why Specify the LX15-11C?
1. Frequency Headroom for Real-Time Processing
The “-11” speed grade isn’t just a marketing label; it’s a necessity for designs pushing 250MHz+ internal logic frequencies. If you are designing high-speed LVDS interfaces or implementing custom encryption/decryption modules, the extra performance binning ensures stable operation across the commercial temperature range.
2. Signal Integrity in Compact Designs
The SFG363 package is designed for clean signal breakouts. When combined with the Virtex-4’s SelectIO™ technology, engineers can achieve excellent signal integrity with minimal cross-talk, even when driving 240 I/Os in a high-density layout.
3. Efficient Power Profile
At a core voltage of 1.2V, the LX15-11C is power-efficient. In space-constrained enclosures where airflow is limited, the low static power consumption of the LX15 helps in maintaining a manageable thermal budget.
Приложения
Embedded Vision: Real-time image pre-processing and sensor data fusion.
High-Speed Bridging: Interfacing between different bus standards (PCIe to local bus).
Telecommunications: SFP/QSFP module management and optical line monitoring.
Defense & Research: High-speed data logging and trigger logic in portable lab equipment.
