XC4VSX35-10FFG668C

제조업체: AMD / 자일링스
로직 셀: 34,560
로직 슬라이스: 3,840
임베디드 RAM(eRAM): 3,456,000비트
패키지: FFG668(27×27mm)
작동 온도: 0°C ~ +85°C(상업용)

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    사양

    모델 P/N시리즈실험실/CLBS 수속도 등급논리 요소/셀 수총 램 비트I/O 수전압 - 공급마운팅 유형작동 온도패키지 / 케이스공급업체 디바이스 패키지
    XC4VSX35-10FFG668CVirtex-4 SX3.840,000,0034560 논리 요소3,538,944비트4481.14V ~ 1.26V표면 실장상업용(0°C ~ +85°C)668-BBGA, FCBGA668-FCBGA(27×27)

    XC4VSX35-10FFG668C: Virtex-4 SX Optimized for Digital Signal Processing

    그리고 XC4VSX35-10FFG668C remains a cornerstone for high-performance DSP applications within the Xilinx Virtex-4 family. Specifically engineered for signal processing-intensive workloads, the SX sub-family provides a significantly higher ratio of DSP48 slices compared to the LX or FX variants.

    Technical Breakdown & Core Specifications

    The “SX” designation is the critical factor here. While the LX focuses on logic density, the SX35 is built for arithmetic heavy-lifting.

    • 로직 셀: 34,560

    • DSP48 Slices: 192 (The primary advantage for filter design and FFTs)

    • Block RAM: 3,456 Kb

    • 최대 사용자 I/O: 448

    • 패키지: FFG668 (Fine-pitch Flip-Chip BGA, Lead-Free/RoHS compliant)

    • 속도 등급: -10

    • Temperature Grade: Commercial (0°C to 85°C)

    Why Sourcing This Part Matters Now

    In the current market, the XC4VSX35-10FFG668C is often utilized in Form, Fit, and Function (FFF) replacements for aging defense and telecommunications hardware. We understand that for these applications, “New/Clean” date codes and verifiable CoC (Certificate of Conformance) documentation are more important than price.

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