XC7VX690T-2FFG1761I
Produsen: AMD (Xilinx)
Sel Logika: 693,120
Irisan Logika: 108,300
RAM tertanam (eRAM): 52.920 Kb (2.940 × 18Kb Blok RAM)
Paket: FFG1761 (Flip-Chip BGA)
Suhu Pengoperasian: Industri (-40°C hingga +100°C)
Spesifikasi
Part Number Full Explanation
This is a Virtex‑7 VX series high-capacity DSP-oriented FPGA from AMD Xilinx, manufactured with 28nm HKMG process, focused on large-scale real-time signal processing and high-speed interconnection systems.
- XC7VX690T: Large-capacity Virtex‑7 device optimized for intensive digital signal processing workloads
- -2: Speed Grade 2, high-performance timing tier with abundant timing margin for complex high-speed logic design
- FFG1761: 1761-ball flip-chip FCBGA package
- I: Industrial temperature grade, junction temperature operating range: -40°C ~ +100°C
On-Chip Core Hardware Resources
Logic and DSP Computing Units
- Total Logic Cells: 693120
- Total Configurable Logic Slices: 108300
- DSP48E1 arithmetic blocks: 3600 pieces, dedicated to FFT operations, digital filtering, massive matrix calculation, radar echo processing and all multiply-accumulate intensive algorithms
Sumber Daya Memori Terintegrasi
- Total Block RAM capacity: 52.92 Mbit, made up of independent dual-port RAM banks for large data buffering, FIFO and intermediate algorithm storage
- Distributed RAM built via internal LUT resources for low-latency small temporary cache
Modul Pengelolaan Jam
14 Clock Management Tiles (CMT) are integrated on chip. Each CMT consists of one MMCM plus one PLL, supporting clock multiplication, division, arbitrary phase shifting and jitter reduction to meet multi-clock domain timing demands for ultra-high-speed digital systems.
High-Speed Transceivers & General I/O Pins
- 72-channel GTX high-speed serial transceivers, maximum per-lane rate up to 12.5 Gbps
Compatible protocols: PCIe Gen2, 10 Gigabit Ethernet, Serial RapidIO, Aurora and inter-board high-speed data transmission
- Total available user I/O pins: 680
- Supports LVCMOS, LVDS and all mainstream differential industrial voltage standards
- Embedded XADC system monitor: tracks chip internal temperature, power supply voltages and external analog input signals
Spesifikasi Catu Daya
- Typical core operating voltage: 1.0 V
- Configurable I/O bank voltage options: 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
- Typical full-load power consumption ranges from 60W to 105W, requiring forced air cooling or liquid cooling heat dissipation structure
Packaging and Assembly Requirements
- Package: 1761-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be completed within 168 hours after vacuum packaging is unsealed
- Lead-free construction, fully compliant with RoHS environmental regulations
- Packed in anti-static trays for automated industrial PCB mass production
Fitur Lingkungan dan Keandalan
Maintains stable long-term operation under wide temperature swings and strong electromagnetic interference.
It supports 256-bit AES bitstream encryption for IP protection, SEU radiation error correction and partial dynamic reconfiguration, ideal for military, aerospace and high-end industrial equipment requiring continuous reliable operation.
Skenario Aplikasi Umum
- Phased array radar, electronic warfare large-scale real-time echo signal processing platforms
- Wireless base station massive MIMO baseband processing and high-speed data switching equipment
- High-end oscilloscopes, spectrum analyzers and ultra-fast transient signal recording instruments
- Aerospace onboard remote sensing big data real-time processing embedded systems
- High-speed multi-channel data acquisition boards and parallel DSP computing acceleration arrays
- Custom high-bandwidth gateway cards and high-performance computing hardware accelerator modules
