| MODEL P / N | SERI | JUMLAH LABORATORIUM/CLBS | TINGKAT KECEPATAN | JUMLAH ELEMEN / SEL LOGIKA | TOTAL BIT RAM | JUMLAH I / O | TEGANGAN - PASOKAN | JENIS PEMASANGAN | SUHU PENGOPERASIAN | PAKET / KASUS | PAKET PERANGKAT PEMASOK |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VLX50-1FFG676C | Virtex-5 LX | 3,60 | -1,00 | 46080 | 1769472 | 440 | 0.95 V – 1.05 V | Pemasangan di Permukaan | 0 °C – +85 °C (C) | 676-FBGA / FCBGA | 676-FCBGA (≈27 × 27 mm) |
XC5VLX50-1FFG676C
Produsen: Xilinx Sel Logika: 51,840 Irisan Logika: 8,160 RAM tertanam (eRAM): 2,448 Kb (136 × 18Kb Block RAM) Paket: FFG676 (Flip-Chip BGA) Suhu Pengoperasian: Komersial (0°C hingga +85°C)
Spesifikasi
XC5VLX330-1FFG1760I is a high-density FPGA designed for complex and large-scale applications requiring massive logic resources.
Fitur Utama
- Up to 330K logic cells
- High I/O count
- Industrial-grade performance
- Advanced system integration
Technical Specifications
- Package: FFG1760
- Tingkat Kecepatan: -1
- Temperature: -40°C to +100°C
Cross Reference
- XC5VLX330-1FFG1760C
- XC5VLX220-1FFG1760I
Aplikasi
- Infrastruktur telekomunikasi
- Data centers
- Military & industrial systems
Stock Availability
🔥 Rare stock available
⏳ Long lead time expected
Call to Action
👉 Contact us now for availability & pricing
