Spesifikasi
KLMBG2JETD-B041 is a 32GB embedded flash storage IC from Samsung, conforming to JEDEC eMMC 5.1 standard. It integrates MLC NAND flash array and dedicated storage management controller inside a single package, designed as built-in persistent storage for mobile terminals, embedded devices and intelligent display equipment.
Part Number Definition
KLMBG series belongs to Samsung mainstream eMMC embedded flash product line. The coding segment defines 32GB user available storage capacity and internal die stacking structure. B041 stands for fixed hardware revision, electrical parameter specification and packaging specification. The original factory provides tape-and-reel packaging by default to support automatic PCB SMT mounting for mass production.
Core Storage and Interface Performance
The chip delivers 32GB effective storage space based on 2-bit MLC flash architecture. It supports HS400 high-speed transmission mode with theoretical maximum interface bandwidth up to 400MB/s. Typical sequential read speed reaches 330MB/s, and sequential write speed ranges from 50MB/s to 100MB/s. The on-board controller automatically executes wear leveling algorithm, bad block detection and replacement, hardware ECC error correction, garbage collection and partition management, shielding underlying NAND operation logic from main processors and lowering host-side software development workload. It supports multi-partition division, RPMB secure partition for confidential data storage, secure data erasure, sanitize operation and online firmware upgrade for the built-in controller.
Power Supply Design
Dual voltage power supply structure is adopted. Flash core array operates at 3.3V voltage, while controller and signal I/O interface support optional 1.8V or 3.3V working voltage to match IO electrical levels of various main control SoCs. Multiple low-power modes including deep sleep and power-off notification are embedded to reduce power consumption during standby and idle status, well suited for battery-powered portable devices and low-power IoT terminals.
Package and Mechanical Parameters
The packaging type is 153-ball FBGA fine pitch ball grid array package, with overall dimension 11.5mm × 13mm × 0.8mm. Moisture Sensitivity Level is MSL 3, and reflow soldering must be completed within 168 hours after opening vacuum moisture-proof packaging. Standard ball layout ensures stable soldering reliability during batch PCB assembly.
Environmental and Compliance Standards
Standard operating temperature range covers -25℃ to +85℃, adapting to consumer electronics and conventional industrial embedded equipment working environments. The product is manufactured with lead-free process and fully complies with RoHS and REACH environmental protection regulations without restricted hazardous substances. Optimized internal circuit layout strengthens anti-electromagnetic interference capability to guarantee stable data reading and writing under complex circuit conditions.
Skenario Aplikasi Umum
Android smartphones, tablets and portable intelligent handheld terminal built-in system storage RK series embedded development boards, commercial advertising machines, digital signage and industrial touch HMI firmware storage POS payment terminals, self-service vending equipment, smart cabinets and access control main controller local storage Smart TV, IPTV set-top boxes, vehicle infotainment hosts and edge IoT gateway data storage Front-end video monitoring cameras, miniature NVR devices and handheld testing instruments program and parameter storage
LXB Semicon supplies original Samsung KLMBG2JETD-B041 32GB eMMC 5.1 flash memory integrated circuit
