xcvu37p-2fsvvh2892e
الشركة المصنعة: AMD (Xilinx)
System Logic Cells: 2,852,000
UltraRAM: 270 Mb
الحزمة: FSVH2892
درجة حرارة التشغيل: Extended (-40°C to +100°C)
المواصفات
تفصيل أرقام القطع
This is an AMD Xilinx Virtex UltraScale+ series FPGA built on 16nm FinFET process, equipped with integrated HBM2 memory, designed for high-throughput signal processing and high-bandwidth computing scenarios.
- XCVU37P: Core device model belonging to VU+ HBM integrated memory product line
- -2: Speed Grade 2, mainstream high-performance timing grade with ample timing margin
- FSVH2892: 2892-ball flip-chip FCBGA package, overall body dimension 55mm × 55mm
- E: Extended industrial temperature grade, junction temperature operating range: -40°C ~ +100°C
الموارد الأساسية للأجهزة المدمجة في الرقاقة
Logic and DSP Computing Resources
- Total Logic Cells: 2,186,880
- Configurable Logic Slices: 124,200
- DSP48E2 arithmetic units: 6848 pieces, optimized for matrix computation, FFT, digital filtering, radar echo processing and AI inference multiply-accumulate operations
موارد الذاكرة
- Aggregate capacity of Block RAM + UltraRAM: 63.27 Mbit
- On-package integrated HBM2 stacked high bandwidth memory, delivering extremely high memory bandwidth to resolve data throughput bottlenecks for large-capacity streaming data
- LUT-based distributed RAM for low-latency small buffer storage
Clock Management Units
Abundant MMCM and PLL clock management tiles are integrated. Functions include clock frequency scaling, phase shifting, jitter filtering and multi-clock domain layout, suitable for ultra-high-speed complex digital systems.
High-Speed Transceivers & General I/O
- 96-channel GTY high-speed serial transceivers, maximum per-channel rate 32.75 Gbps
Compatible with PCIe Gen5, 400G Ethernet, Interlaken, RapidIO and other mainstream high-speed serial protocols
- Available user general I/O pins: 624
- Supports LVCMOS, LVDS and multiple differential electrical standards
Hardened Built-In IP Cores
Embedded dedicated hard IP blocks: PCIe Gen4/Gen5 controller, 100G Ethernet MAC, AXI4 bus infrastructure, memory controllers, which save massive programmable logic resources and shorten project development cycles.
مواصفات مصدر الطاقة
- Core logic typical supply voltage: 0.85 V
- Multiple independent power domains support dynamic voltage and frequency adjustment to balance performance and power consumption
- Typical full-load power consumption ranges from 105 W to 140 W, requiring forced air cooling or liquid cooling solutions
مواصفات التعبئة والتجميع
- Package type: 2892-ball flip-chip FCBGA, size 55mm × 55mm
- Moisture Sensitivity Level: MSL3. Reflow soldering must be finished within 168 hours once vacuum packaging is unsealed
- Lead-free construction, fully compliant with RoHS environmental regulations
- Packaged in anti-static trays for automated large-scale PCB assembly
Environmental and Reliability Features
- Extended industrial temperature rating ensures stable operation under drastic temperature fluctuations and intense electromagnetic interference
- 256-bit AES bitstream encryption and anti-tampering mechanism to protect proprietary algorithm IP
- SEU radiation error correction and partial dynamic reconfiguration functions, suitable for long-term continuous operation in aerospace, military and outdoor industrial equipment
مجالات التطبيق النموذجية
- Data center high-speed network accelerator cards, 100G/400G packet processing and traffic forwarding systems
- Wireless communication base station massive MIMO baseband processing platforms
- Radar, electronic warfare real-time signal acquisition and large-scale echo processing systems
- High-end oscilloscopes, spectrum analyzers and ultra-high-speed data recording instruments
- Aerospace onboard computing, remote sensing massive data real-time processing equipment
- Edge AI hardware acceleration, multi-channel high-definition video decoding and image processing platforms
