| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc7k420t-1ffg901i | كينتكس-7 | 32.575,00 | -1,00 | 416,960 | 30781440 | 380 | 0.97 - 1.03 فولت (النوع 1.0 فولت) | التركيب على السطح | -40 درجة مئوية - 100 درجة مئوية | 901-FCBGA | 901-FCBGA |
xc7k420t-1ffg901i
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 419,840
شرائح المنطق: 65,600
ذاكرة الوصول العشوائي المدمجة (eRAM): 30,240 كيلو بايت (840 × 36 كيلو بايت من ذاكرة الوصول العشوائي المجمعة)
الحد الأقصى لإدخال/إخراج المستخدم: 400
الحزمة: FFG901 (Flip-Chip BGA)
درجة السرعة: -1
درجة حرارة التشغيل: صناعي (-40 درجة مئوية إلى +100 درجة مئوية)
المواصفات
تعريف رقم القطعة
This industrial temperature low-power FPGA belongs to Xilinx Kintex-7 family, manufactured on mature 28nm HKMG process with unified 7-series architecture. It balances logic capacity, DSP computing capability, high-speed serial bandwidth and power consumption, optimized for battery-powered portable field devices, vehicle-mounted embedded systems, outdoor industrial signal acquisition terminals and miniaturized airborne auxiliary electronics that demand stable continuous operation across the full industrial temperature range.
- XC7K420T: Large-capacity mainstream device in Kintex-7 lineup, widely used in medium-to-large digital systems for communication, radar signal processing and industrial control fields
- -1: Speed Grade 1, low-power timing variant. Thermal stability and power saving are prioritized over maximum clock frequency, ideal for long-running hardware with limited heat dissipation space
- FFG901: 901-ball flip-chip FCBGA package. Compact size delivers good thermal performance and signal integrity, sufficient pins fully accommodate all integrated GTX transceivers, general-purpose I/O and multi-channel DDR3 memory interfaces
- I: Industrial temperature grade, continuous junction temperature operating range: -40°C ~ +100°C
معلمات موارد الأجهزة المدمجة في الرقاقة
1. Programmable Logic Resources
- Total System Logic Cells: 423360
- Available CLB Slices: 65850
- Total Flip-Flops: 1317000
- Total LUTs: 658500
- Distributed RAM Capacity: 6.01 Mb
2. موارد الحساب والذاكرة المدمجة
- DSP48E1 arithmetic units: 1680 pieces, used for fixed-point and floating-point computation, large-scale FFT analysis, wireless baseband demodulation, radar echo processing and cryptographic algorithm acceleration
- Total Block RAM: 30.85 Mb, applied to image frame buffering, deep FIFO caching, waveform data storage and algorithm parameter tables
3. Clock Management Subsystem
- 10 MMCM clock tiles
- 10 PLL phase-locked loops
Multiple independent clock domains can be configured flexibly. The system supports precise clock phase adjustment, signal delay compensation and low jitter suppression, meeting strict timing synchronization requirements of complex digital signal processing and communication systems
4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة
- 32 GTX differential high-speed transceivers
Maximum per-lane rate reaches 12.5 Gbps, compatible with PCIe Gen2, 10G Ethernet, Aurora, JESD204B and mainstream industrial serial protocols. Built-in hard protocol controllers shorten high-bandwidth interface development cycles
5. I/O Interfaces & System Monitoring Module
- Configurable user I/O pins: 400
Multiple I/O banks cover voltage range from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all standard single-ended and differential signal standards
Embedded XADC module monitors chip junction temperature, internal core voltages and external analog signals in real time continuously
Power Supply Characteristics
The core voltage of Speed Grade 1 is optimized for low power consumption. Logic fabric, Block RAM, DSP arrays and serial transceivers are divided into separate power domains, supporting partial power gating to dynamically reduce overall power draw
Typical total power consumption: 14W ~ 38W. For stable full-load operation at the upper industrial temperature limit, forced air cooling is required
Packaging and SMT Assembly Specifications
- Package Type: 901-pin Flip-Chip BGA
- Moisture Sensitivity Level: MSL4. All reflow soldering must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS standards
- Chips are stored and shipped in anti-static trays to prevent electrostatic damage during mass PCB assembly
Environmental Adaptability and Reliability
The chip can operate steadily for extended periods under extreme temperature swings, mechanical shock, vibration and strong electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU error detection and correction, with basic radiation tolerance reinforcement. It is suitable for outdoor industrial, vehicle-mounted, military portable and miniature aerospace application scenarios, and cannot be replaced by commercial temperature devices in harsh working conditions.
سيناريوهات التطبيق النموذجية
- Lightweight UAV payload signal preprocessing boards and small satellite communication auxiliary modules
- Compact rugged VPX baseband processing motherboards for military portable radio devices
- Handheld field spectrum analyzers and outdoor portable arbitrary waveform generators
- Outdoor multi-channel industrial sensor network data acquisition and real-time signal analysis systems
- Medium-scale communication algorithm verification platforms with strict power and volume constraints
- Vehicle intelligent perception front-end preprocessing units and wide-temperature industrial edge gateways
