| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K7K355T-L2FG901E | كينتكس-7 | 27.825,00 | -2,00 | 356,160 | 26357760 | 300 | 0.97 - 1.03 | التركيب على السطح | 0 درجة مئوية ... +100 درجة مئوية (ه) | FCCBGA-901 (FFCBGA-901) | 901-FCBGA (31×31) |
XC7K7K355T-L2FG901E
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 354,720
شرائح المنطق: 55,425
ذاكرة الوصول العشوائي المدمجة (eRAM): 32,400 Kb (900 × 36Kb Block RAM)
الحد الأقصى لإدخال/إخراج المستخدم: 400
الحزمة: FFG901 (Flip-Chip BGA)
درجة السرعة: -2 لتر
درجة حرارة التشغيل: ممتد (من 0 درجة مئوية إلى +100 درجة مئوية)
المواصفات
تعريف رقم القطعة
This extended commercial temperature low-power FPGA belongs to AMD Xilinx Kintex-7 family, fabricated on mature 28nm HKMG high-k metal gate semiconductor process with standardized 7-series architecture. It achieves balanced performance, power consumption and cost, tailored for indoor server room communication equipment, laboratory signal testing instruments, stationary industrial video processing systems and wired transmission hardware operating under stable indoor ambient temperature conditions.
- XC7K355T: Mid-large capacity mainstream device of Kintex-7 lineup, widely adopted in wireless baseband processing, digital signal analysis and industrial control systems, featuring excellent cost-performance balance
- L2: Grade 2 low-power optimized timing variant. Static leakage power and dynamic switching power are comprehensively optimized; thermal stability and power saving are prioritized over maximum operating frequency, perfectly suited for long-term continuously running indoor devices with limited heat dissipation space
- FFG901: 901-ball flip-chip FCBGA package, physical dimension 31mm × 31mm. The package delivers reliable heat dissipation and superior signal integrity; abundant pins fully support full layout of all integrated GTX transceivers, general-purpose I/O banks and multi-channel DDR3 memory interfaces
- E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C
معلمات موارد الأجهزة المدمجة في الرقاقة
1. Programmable Logic Resources
- Total System Logic Cells: 356,160
- Configurable CLB Slices: 55,650
- Total Flip-Flops: 1,113,000
- Total LUT Lookup Tables: 556,500
- Distributed RAM Capacity: 5.09 Mb
2. Arithmetic & Embedded Memory Resources
- DSP48E1 arithmetic slices: 1,440 units, dedicated to fixed-point/floating-point calculation, large-scale FFT spectrum analysis, wireless communication baseband demodulation, radar echo signal processing and lightweight cryptographic algorithm acceleration tasks
- Total Block RAM Capacity: 25.74 Mb, utilized for image frame buffering, deep-depth FIFO data caching, waveform raw data storage and algorithm parameter table storage
3. Clock Management Subsystem
- 10 MMCM clock management tiles
- 10 PLL phase-locked loops
Multiple mutually independent clock domains can be flexibly configured. The subsystem supports precise clock phase shifting, signal transmission delay compensation and low-jitter clock generation, fully satisfying strict synchronous timing requirements of medium-scale communication and digital signal processing systems
4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة
- 24 GTX differential high-speed serial transceivers
Maximum single-lane transmission rate reaches 12.5 Gbps, compatible with PCIe Gen2, 10G Ethernet, Aurora, JESD204B and mainstream industrial high-speed serial communication protocols. Built-in hard protocol controllers effectively shorten the development cycle of high-bandwidth data transmission interfacesAMD
5. واجهات الإدخال/الإخراج ووحدة المراقبة المدمجة في الرقاقة
- Total configurable user I/O pins: 300
Multiple I/O voltage banks cover 1.2V ~ 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended & differential signal standards
Embedded XADC mixed-signal monitoring module continuously collects real-time data of chip junction temperature, internal core supply voltages and external analog input signals
Power Supply Characteristics
The L2 low-power grade adopts optimized core operating voltage ranging from 0.97V to 1.03V. Programmable logic fabric, block RAM, DSP arrays and serial transceivers are divided into mutually independent power domains, supporting partial module power gating to dynamically reduce overall power consumption
Typical total power consumption range: 12W ~ 34W. Continuous full-load operation at the upper extended temperature limit requires forced air cooling configuration
Packaging and SMT Assembly Specifications
- Package Form: 901-pin Flip-Chip BGA
- Moisture Sensitivity Level: MSL4. All reflow soldering operations must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS3 environmental standards
- Devices are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly production
Environmental Adaptability and Operational Reliability
This chip is customized for indoor constant-temperature working environments. It runs stably for extended periods under mild temperature fluctuations, slight mechanical vibration and conventional electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection & correction, without radiation-hardened reinforcement design, and cannot adapt to outdoor low-temperature and severe rugged application scenarios
سيناريوهات التطبيق النموذجية
- Low-density 10G optical communication line cards and auxiliary switching control boards deployed in enterprise server rooms
- Desktop spectrum analyzers, arbitrary waveform generators and multi-channel high-speed data acquisition instruments for electronic laboratories
- Industrial 4K real-time video encoding/decoding equipment and medium-precision machine vision image processing platforms
- Small and medium-scale communication chip prototype verification and wireless algorithm development platforms for universities and research institutes
- Indoor industrial high-speed data gateways and desktop lightweight cryptographic acceleration hardware
