| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc7k160t-2fbg484e | كينتكس-7 | 12.675,00 | -2,00 | 162,240 | 11980800 | 285 | 0.97 - 1.03 V | التركيب على السطح | 0 درجة مئوية - 100 درجة مئوية | 484-BBGA, FCCBGA, 484-BBGA | 484-FCBGA (23 × 23) |
xc7k160t-2fbg484e
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 162,240
شرائح المنطق: 25,350
ذاكرة الوصول العشوائي المدمجة (eRAM): 11,700 كيلو بايت (325 × 36 كيلو بايت من ذاكرة الوصول العشوائي المجمعة)
الحد الأقصى لإدخال/إخراج المستخدم: 285
الحزمة: رقاقة FBG484 (رقاقة الوجه BGA)
درجة السرعة: -2
درجة حرارة التشغيل: ممتد (من 0 درجة مئوية إلى +100 درجة مئوية)
المواصفات
شرح رقم القطعة
This medium-density industrial-grade FPGA is part of the Xilinx Kintex-7 family, fabricated on the mature 28nm semiconductor process. It balances logic resources, power consumption, hardware volume and overall cost, targeted at miniaturized industrial control, data acquisition equipment and compact communication modules that need stable operation across a wide industrial temperature range.
- XC7K160T: Mid-density device within Kintex-7 series; suffix T represents low-power optimized silicon die
- -2: Speed Grade 2, the widely used balanced timing grade. It reserves sufficient timing margin for most medium-scale digital designs, achieving a rational balance between working frequency, timing stability and total power draw
- FBG484: 484-ball flip-chip BGA compact package. Small outline dimension supports equipment miniaturization layout while retaining essential I/O expansion capacity
- E: Extended industrial temperature rating, operating junction temperature range: -40°C ~ +100°C
On-Chip Hardware Resource Details
1. الموارد العامة للمنطق القابل للبرمجة
- Total Logic Cells: 162240
- Available Configurable Slices: 25350
- Total Flip-Flops: 202800
- Total LUT Lookup Tables: 101400
2. موارد الحساب والذاكرة المدمجة
- DSP48E1 arithmetic blocks: 600 units, applicable to FFT computation, digital filtering, servo motor control algorithms, sensor signal processing and medium-sized matrix calculations
- Total Block RAM Capacity: 11682 Kb, utilized for data buffering, FIFO queues, waveform caching and system parameter storage
- Distributed RAM Capacity: 3288 Kb
3. نظام إدارة الوقت
- 8 MMCM clock management tiles
- 8 PLL phase locked loops
Capable of multi-clock domain generation, phase trimming, clock delay compensation and high-frequency jitter reduction, satisfying timing synchronization requirements of medium-complexity embedded systems
4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة
- 8 GTX differential high-speed transceivers
Maximum line rate up to 10.3125 Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, Aurora and other mainstream serial communication standards
5. I/O Interfaces & Built-In Monitoring Module
- User configurable I/O pins: 285
I/O bank supply voltage adjustable from 1.2V to 3.3V, fully compliant with LVCMOS, LVDS, HSTL, SSTL and universal differential signal specifications
Integrated dual-channel 12-bit XADC analog monitor, continuously tracking die junction temperature, internal power rail voltages and external analog input signals in real time
Power Specifications
Nominal core operating voltage: 1.0V
Independent isolated power domains are assigned to logic fabric, Block RAM, DSP arrays and serial transceivers separately
Typical total power consumption: 3.8W ~ 15W; passive heat dissipation is adequate for regular continuous operation under most industrial working conditions
Packaging & SMT Assembly Standards
- Package Type: 484-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering operations must be finished within 168 hours once vacuum packaging is unsealed
- Lead-free packaging design, fully compliant with RoHS environmental regulations
- Packaged and transported in anti-static trays to prevent electrostatic damage during automated PCB mass production
القدرة على التكيف مع البيئة والموثوقية
The chip maintains long-term stable operation under temperature swings, mechanical vibration and moderate electromagnetic interference in harsh industrial environments. It supports 256-bit AES bitstream encryption and SEU single-event upset detection, delivering strong anti-interference performance for field-deployed rugged equipment.
سيناريوهات التطبيق النموذجية
- Compact multi-axis motion controllers, small-scale industrial automation main control boards
- Mini industrial Ethernet gateways, fieldbus protocol conversion modules
- Portable multi-channel sensor acquisition devices, on-site vibration and environmental monitoring terminals
- Auxiliary baseband processing units for small wireless communication devices
- Logic control and data preprocessing boards for portable medical equipment
- Wide-temperature medium-performance industrial core boards and embedded algorithm verification platforms
