| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc4vlx60-11ffg668i | Virtex-4 LX | 6.656,00 | -11,00 | 59 904 59 904 جنيه مصري | 2 949 949 120 بت ≈ 2.95 ميغابت | 448 | 1.14 فولت ~ 1.26 فولت | التركيب على السطح | صناعي (-40 درجة مئوية إلى +100 درجة مئوية تحت الصفر) | 668-BBGA, FCBGA, 668-BBGA, FCBGA | 668-FCBGA (27×27) |
XC4VLX60-11FFG668I: High-Performance Industrial Virtex-4 LX FPGA
إن xc4vlx60-11ffg668i is a high-density logic platform within the Xilinx Virtex-4 family, engineered for demanding industrial environments. Offering 59,904 logic cells, it serves as a critical component for complex system integration, including high-speed bus arbitration, medical imaging data paths, and aerospace control systems.
The combination of the -11 speed grade و Industrial temperature rating makes this part the most robust version of the LX60 in the FFG668 footprint. It provides the necessary timing slack for high-frequency designs while ensuring reliable operation between -40°C and +100°C.
Core Technical Specifications
الخلايا المنطقية: 59,904
CLB Array: 64 x 96
Total Block RAM: 2,880 Kb (160 blocks of 18 Kb)
DSP48 Slices: 64
Maximum User I/O: 448
الحزمة: FFG668 (Fine-pitch Flip-Chip BGA, 1.0mm pitch)
درجة السرعة: -11 (Mid-high performance tier)
Temperature Grade: Industrial ($-40°C$ to $+100°C$ $T_j$)
Engineering & Design Considerations
1. Timing Closure at the -11 Speed Grade
The -11 speed grade is roughly 10-12% faster than the -10 variant. This is often the difference between meeting or failing timing on complex cross-die routing paths. When substituting this part into a design originally binned for a -10, it is a “safe” upgrade, but we recommend re-verifying hold times ($T_h$) in your Static Timing Analysis (STA), as the faster silicon can occasionally expose race conditions in poorly constrained paths.
2. Thermal and Power Integrity
With nearly 60k logic cells switching at -11 speeds, the LX60 can generate significant localized heat. The FFG668 flip-chip package offers superior thermal conductivity ($\theta_{JC}$), but in industrial enclosures, active cooling or high-performance TIM (Thermal Interface Material) is recommended to keep the junction temperature below the $100°C$ limit. Ensure your $V_{CCINT}$ (1.2V) regulator is sized for the increased dynamic current associated with the -11 grade’s higher toggle rates.
3. Software Lifecycle Note
The XC4VLX60 is a mature product and is not compatible with Xilinx Vivado. All maintenance, bitstream generation, and debugging must be performed using Xilinx ISE Design Suite 14.7. Ensure your project constraints (.ucf) are archived and mapped correctly to the FFG668 pinout.
Comparison: Virtex-4 LX60 Speed & Temp Options
| الميزة | xc4vlx60-11ffg668i | xc4vlx60-10ffg668c |
| درجة السرعة | -11 (High Performance) | -10 (Standard) |
| نطاق درجة الحرارة | صناعي (-40 درجة مئوية إلى +100 درجة مئوية) | تجاري (0 درجة مئوية إلى +85 درجة مئوية) |
| الخلايا المنطقية | 59,904 | 59,904 |
| Reliability | Enhanced (Ruggedized) | Standard |
Hardware Engineer’s FAQ
Can this part replace the XC4VLX60-10FFG668C?
Yes. It is a “top-tier” replacement. It covers a wider temperature range and offers faster switching speeds. Since it is the same FFG668 package, it is footprint-compatible and bitstream-compatible (though a timing re-simulation is always best practice).
Is the FFG668 package RoHS compliant?
Yes. The “G” in FFG668 denotes lead-free/RoHS compliance. If your legacy assembly process uses Leaded (SnPb) solder, you must adjust your reflow profile to accommodate the higher melting point of the lead-free BGA balls to ensure a reliable joint.
How do you handle EOL (End of Life) sourcing for this part?
We understand that the Virtex-4 LX60 is a mature component. We focus on providing parts with verifiable Date Codes and provide full visual and electrical inspections (where required) to ensure that the silicon has been stored in MSL-compliant environments.
Need a technical datasheet or a quote for high-reliability applications?
We support long-lifecycle programs with traceable, original Xilinx silicon.
Would you like me to check the current inventory for a specific Date Code (D/C) or provide the IBIS models for the FFG668 package?
للتواصل مع LXB Semicon for availability, pricing, and technical support.
